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Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (71 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-5386-6103-9 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996280707103316 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers
| Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / / Institute of Electrical and Electronics Engineers |
| Pubbl/distr/stampa | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 |
| Descrizione fisica | 1 online resource (71 pages) |
| Disciplina | 621.3815 |
| Soggetto topico |
Integrated circuits
Very high speed integrated circuits |
| ISBN | 1-5386-6103-9 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910280915703321 |
| Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||