Microsystem technology / / W. Menz, J. Mohr, and O. Paul

• Autore: Menz W (Wolfgang)
• Pubblicazione: Weinheim, Germany ; ; New York, New York : , : Wiley-VCH, , [2001]; ©2001
• Descrizione fisica: 1 online resource (515 p.)
• Disciplina: 621.381
• Soggetto topico: Microelectronics
• Persona (resp. second.): MohrJ (Jürgen); PaulOliver
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references (pages [465]-483) and index.
• Nota di contenuto: Microsystern Technology; Content; 1 General Introduction to Microstructure Technology; 1.1 What is Microstructure Technology?; 1.2 From Microstructure Technology to Microsystems Technology; 2 The Parallels to Microelectronics; 2.1 The Production of Single Crystal Wafers; 2.1.1 Production of Silicon-Single Crystals; 2.1.2 Production of GaAs Single Crystals; 2.2 Basic Technical Processes; 2.2.1 Film Deposition; 2.2.2 Lithography (Film Patterning); 2.2.3 Surface Modification; 2.2.4 Etching (Film Removal); 2.3 Packaging Technology; 2.3.1 Requirements for Packaging Technology ; 2.3.2 Hybrid Technology2.4 Clean Room Techniques; 3 The Physical and Chemical Basics in Microtechnology; 3.1 Crystals and Crystallography; 3.1.1 Lattice and Types of Lattices; 3.1.2 Stereographic Projection; 3.1.3 The Silicon Single Crystal; 3.1.4 Reciprocal Lattice and the Analysis of the Crystal Structure; 3.2 Methods to Determine the Crystalline Structure; 3.2.1 X-ray Diffraction; 3.2.2 Electron Beam Diffraction; 3.3 Basic Concepts of Electroplating; 3.3.1 The Electrode-Electrolyte Interface; 3.3.2 Polarization and Overpotential; 3.3.3 Mechanisms of Cathodic Metal Deposition ; 3.4 Materials of Microsystems Technology4 Basic Technologies in MEMS; 4.1 Basic Principles of Vacuum Technology; 4.1.1 The Mean Free Path; 4.1.2 The Monolayer Time; 4.1.3 Velocity of Atoms and Molecules; 4.1.4 Gas Dynamics; 4.1.5 The Classification of Technical Vacuums; 4.2 Vacuum Production; 4.2.1 Pumps for Rough- and Fine Vacuums; 4.2.2 High Vacuum- and Ultrahigh Vacuum Pumps; 4.3 Vacuum Measurement; 4.3.1 Pressure Transducer; 4.3.2 Thermal Conductivity Vacuum Gauge; 4.3.3 Friction Type Vacuum Gauge; 4.3.4 Thermionic Ionization Vacuum Gauge ; 4.3.5 Cold Cathode Ionization Gauge (Penning Principle)4.3.6 Leakage and Leak Detection; 4.4 Properties of Thin Films; 4.4.1 Structure Zone Model; 4.4.2 Adhesive Strength of the Layer; 4.5 Physical and Chemical Coating Techniques; 4.5.1 Evaporation; 4.5.2 Sputtering; 4.5.3 Ion Plating or Plasma Assisted Deposition; 4.5.4 Ion Cluster Beam Technology; 4.5.5 CVD Processes; 4.5.6 Epitaxy; 4.5.7 Plasma Polymerization; 4.5.8 Oxidation; 4.6 Structuring of Thin Films with Dry Etch Processes; 4.6.1 Physical Etch Technologies; 4.6.2 Combined Physical and Chemical Etch Technologies ; 4.6.3 Chemical Etching Technologies4.7 Analysis of Thin Films and Surfaces; 4.7.1 Electron Probe Microanalysis (EPM); 4.7.2 Auger Electron Spectroscopy (AES); 4.7.3 X-Ray Photoelectron Spectroscopy (XPS); 4.7.4 Secondary Ion Mass Spectroscopy (SIMS); 4.7.5 Secondary Neutral Particle Mass Spectroscopy (SNMS); 4.7.6 Ion Scattering Spectroscopy (ISS); 4.7.7 Rutherford Back Scattering Spectroscopy (RBS); 4.7.8 Scanning Tunneling Microscope; 5 Lithography; 5.1 Overview and History; 5.2 Resists; 5.3 Process of Lithography; 5.4 Computer Aided Design (CAD); 5.4.1 CAD-Layout ; 5.4.2 Alignment Patterns and Test Structures
• Sommario/riassunto: This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.
• Titolo autorizzato: Microsystem technology
• ISBN: 1-281-76403-5; 9786611764036; 3-527-61300-5; 3-527-61301-3
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910829927203321
• Lo trovi qui: Univ. Federico II