LEADER 04957nam 2200637 450 001 9910829927203321 005 20230107002046.0 010 $a1-281-76403-5 010 $a9786611764036 010 $a3-527-61300-5 010 $a3-527-61301-3 035 $a(CKB)1000000000377538 035 $a(EBL)481454 035 $a(SSID)ssj0000202660 035 $a(PQKBManifestationID)11200209 035 $a(PQKBTitleCode)TC0000202660 035 $a(PQKBWorkID)10252411 035 $a(PQKB)10779882 035 $a(MiAaPQ)EBC481454 035 $a(MiAaPQ)EBC7076233 035 $a(Au-PeEL)EBL7076233 035 $a(OCoLC)184983844 035 $a(EXLCZ)991000000000377538 100 $a20230107d2001 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aMicrosystem technology /$fW. Menz, J. Mohr, and O. Paul 210 1$aWeinheim, Germany ;$aNew York, New York :$cWiley-VCH,$d[2001] 210 4$dİ2001 215 $a1 online resource (515 p.) 300 $aDescription based upon print version of record. 311 $a3-527-29634-4 320 $aIncludes bibliographical references (pages [465]-483) and index. 327 $aMicrosystern Technology; Content; 1 General Introduction to Microstructure Technology; 1.1 What is Microstructure Technology?; 1.2 From Microstructure Technology to Microsystems Technology; 2 The Parallels to Microelectronics; 2.1 The Production of Single Crystal Wafers; 2.1.1 Production of Silicon-Single Crystals; 2.1.2 Production of GaAs Single Crystals; 2.2 Basic Technical Processes; 2.2.1 Film Deposition; 2.2.2 Lithography (Film Patterning); 2.2.3 Surface Modification; 2.2.4 Etching (Film Removal); 2.3 Packaging Technology; 2.3.1 Requirements for Packaging Technology 327 $a2.3.2 Hybrid Technology2.4 Clean Room Techniques; 3 The Physical and Chemical Basics in Microtechnology; 3.1 Crystals and Crystallography; 3.1.1 Lattice and Types of Lattices; 3.1.2 Stereographic Projection; 3.1.3 The Silicon Single Crystal; 3.1.4 Reciprocal Lattice and the Analysis of the Crystal Structure; 3.2 Methods to Determine the Crystalline Structure; 3.2.1 X-ray Diffraction; 3.2.2 Electron Beam Diffraction; 3.3 Basic Concepts of Electroplating; 3.3.1 The Electrode-Electrolyte Interface; 3.3.2 Polarization and Overpotential; 3.3.3 Mechanisms of Cathodic Metal Deposition 327 $a3.4 Materials of Microsystems Technology4 Basic Technologies in MEMS; 4.1 Basic Principles of Vacuum Technology; 4.1.1 The Mean Free Path; 4.1.2 The Monolayer Time; 4.1.3 Velocity of Atoms and Molecules; 4.1.4 Gas Dynamics; 4.1.5 The Classification of Technical Vacuums; 4.2 Vacuum Production; 4.2.1 Pumps for Rough- and Fine Vacuums; 4.2.2 High Vacuum- and Ultrahigh Vacuum Pumps; 4.3 Vacuum Measurement; 4.3.1 Pressure Transducer; 4.3.2 Thermal Conductivity Vacuum Gauge; 4.3.3 Friction Type Vacuum Gauge; 4.3.4 Thermionic Ionization Vacuum Gauge 327 $a4.3.5 Cold Cathode Ionization Gauge (Penning Principle)4.3.6 Leakage and Leak Detection; 4.4 Properties of Thin Films; 4.4.1 Structure Zone Model; 4.4.2 Adhesive Strength of the Layer; 4.5 Physical and Chemical Coating Techniques; 4.5.1 Evaporation; 4.5.2 Sputtering; 4.5.3 Ion Plating or Plasma Assisted Deposition; 4.5.4 Ion Cluster Beam Technology; 4.5.5 CVD Processes; 4.5.6 Epitaxy; 4.5.7 Plasma Polymerization; 4.5.8 Oxidation; 4.6 Structuring of Thin Films with Dry Etch Processes; 4.6.1 Physical Etch Technologies; 4.6.2 Combined Physical and Chemical Etch Technologies 327 $a4.6.3 Chemical Etching Technologies4.7 Analysis of Thin Films and Surfaces; 4.7.1 Electron Probe Microanalysis (EPM); 4.7.2 Auger Electron Spectroscopy (AES); 4.7.3 X-Ray Photoelectron Spectroscopy (XPS); 4.7.4 Secondary Ion Mass Spectroscopy (SIMS); 4.7.5 Secondary Neutral Particle Mass Spectroscopy (SNMS); 4.7.6 Ion Scattering Spectroscopy (ISS); 4.7.7 Rutherford Back Scattering Spectroscopy (RBS); 4.7.8 Scanning Tunneling Microscope; 5 Lithography; 5.1 Overview and History; 5.2 Resists; 5.3 Process of Lithography; 5.4 Computer Aided Design (CAD); 5.4.1 CAD-Layout 327 $a5.4.2 Alignment Patterns and Test Structures 330 $aThis completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating. 606 $aMicroelectronics 615 0$aMicroelectronics. 676 $a621.381 700 $aMenz$b W$g(Wolfgang),$0971799 702 $aMohr$b J$g(Ju?rgen), 702 $aPaul$b Oliver 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910829927203321 996 $aMicrosystem technology$93935844 997 $aUNINA