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Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT



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Titolo: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems : EuroSimE 2007 / / edited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT Visualizza cluster
Pubblicazione: IEEE
Disciplina: 621.38101/1
Soggetto topico: Microelectronics - Simulation methods
Systems engineering - Simulation methods
Altri autori: ErnstL. J  
Titolo abbreviato (Periodici): THERMAL, MECHANICAL & MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ON
THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ON
Altri titoli varianti: VLSI Design
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Titolo autorizzato: Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems  Visualizza cluster
ISBN: 1-5090-8960-8
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910143028503321
Lo trovi qui: Univ. Federico II
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