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200 10$aProceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems $eEuroSimE 2007 /$fedited by L.J. Ernst ... [et al.] ; fully sponsored by IEEE--CPMT
210   $cIEEE
311   $a1-4244-1105-X 
311   $a1-4244-1106-8 
517   $aVLSI Design 
517   $a2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
531   $aTHERMAL, MECHANICAL & MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ON
531   $aTHERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION EXPERIMENTS IN MICROELECTRONICS & MICRO-SYSTEMS, 2007. EUROSIME 2007. INTERNATIONAL CONFERENCE ON
606   $aMicroelectronics$xSimulation methods$vCongresses
606   $aSystems engineering$xSimulation methods$vCongresses
615  0$aMicroelectronics$xSimulation methods
615  0$aSystems engineering$xSimulation methods
676   $a621.38101/1
701   $aErnst$b L. J$01063494
712 02$aComponents, Packaging & Manufacturing Technology Society.
906   $aPROCEEDING
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996   $aProceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems$92872543
997   $aUNINA