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2000 3rd Electronics Packaging Technology Conference



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Titolo: 2000 3rd Electronics Packaging Technology Conference Visualizza cluster
Pubblicazione: [Place of publication not identified], : I E E E, 2000
Descrizione fisica: 1 online resource
Disciplina: 621.381/046
Soggetto topico: Electronic packaging
Altri autori: LimThiam Beng  
LeeCharles  
TohKok Chuan  
Note generali: Bibliographic Level Mode of Issuance: Monograph
Nota di bibliografia: Includes bibliographical references and index.
Sommario/riassunto: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Titolo autorizzato: 2000 3rd Electronics Packaging Technology Conference  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 996213530503316
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Materials for high-density electronic packaging and interconnection [[electronic resource] ] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
Lead-free solder interconnect reliability [[electronic resource] /] / edited by Dongkai Shangguan
1997 International Symposium on Advanced Packaging Materials
Proceedings of the 1997 1st Electronic Packaging Technology Conference