|
|
|
|
|
|
|
|
1. |
Record Nr. |
UNISA996213530503316 |
|
|
Titolo |
2000 3rd Electronics Packaging Technology Conference |
|
|
|
|
|
Pubbl/distr/stampa |
|
|
[Place of publication not identified], : I E E E, 2000 |
|
|
|
|
|
|
|
Descrizione fisica |
|
|
|
|
|
|
Altri autori (Persone) |
|
LimThiam Beng |
LeeCharles |
TohKok Chuan |
|
|
|
|
|
|
|
|
Disciplina |
|
|
|
|
|
|
Soggetti |
|
|
|
|
|
|
Lingua di pubblicazione |
|
|
|
|
|
|
Formato |
Materiale a stampa |
|
|
|
|
|
Livello bibliografico |
Monografia |
|
|
|
|
|
Note generali |
|
Bibliographic Level Mode of Issuance: Monograph |
|
|
|
|
|
|
Nota di bibliografia |
|
Includes bibliographical references and index. |
|
|
|
|
|
|
Sommario/riassunto |
|
Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies. |
|
|
|
|
|
|
|