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Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate / / Ali Abdul-Aziz, Ramakrishna T. Bhatt, Morris Girgis



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Autore: Abdul-Aziz Ali Visualizza persona
Titolo: Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate / / Ali Abdul-Aziz, Ramakrishna T. Bhatt, Morris Girgis Visualizza cluster
Pubblicazione: Cleveland, Ohio : , : National Aeronautics and Space Administration, Glenn Research Center, , November 2002
Descrizione fisica: 1 online resource (9 pages) : color illustrations
Soggetto topico: Ceramics
Finite elements
Silicon nitrides
Thermal stresses
Thermal conductivity
Persona (resp. second.): BhattRamakrishna T.
GirgisMorris
Note generali: Title from title screen (viewed Sept. 29, 2015).
"November 2002."
"Prepared for the 26th Annual International Conference on Advanced Ceramics and Composites sponsored by the American Ceramic Society, Cocoa Beach, Florida, January 13-18, 2002."
Nota di bibliografia: Includes bibliographical references (page 5).
Titolo autorizzato: Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910704093903321
Lo trovi qui: Univ. Federico II
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