02056nam 2200517I 450 991070409390332120150929110641.0(CKB)5470000002436711(OCoLC)922538818(EXLCZ)99547000000243671120150929j200211 ua 0engurcn|||||||||txtrdacontentcrdamediacrrdacarrierInfluence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate /Ali Abdul-Aziz, Ramakrishna T. Bhatt, Morris GirgisCleveland, Ohio :National Aeronautics and Space Administration, Glenn Research Center,November 2002.1 online resource (9 pages) color illustrationsNASA/TM ;2002-211688Title from title screen (viewed Sept. 29, 2015)."November 2002.""Prepared for the 26th Annual International Conference on Advanced Ceramics and Composites sponsored by the American Ceramic Society, Cocoa Beach, Florida, January 13-18, 2002."Includes bibliographical references (page 5).CeramicsnasatFinite elementsnasatSilicon nitridesnasatThermal stressesnasatThermal conductivitynasatCeramics.Finite elements.Silicon nitrides.Thermal stresses.Thermal conductivity.Abdul-Aziz Ali1395980Bhatt Ramakrishna T.Girgis MorrisNASA Glenn Research Center,United States.National Aeronautics and Space Administration,NASA Glenn Research Center.GPOGPOBOOK9910704093903321Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate3525799UNINA