2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
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| Titolo: |
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
| Descrizione fisica: | 1 online resource (423 pages) |
| Disciplina: | 621.381046 |
| Soggetto topico: | Microelectronic packaging |
| Microelectromechanical systems | |
| Titolo autorizzato: | 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) |
| ISBN: | 1-5090-8060-0 |
| 1-4244-3624-9 | |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910145427103321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |