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Record Nr. |
UNINA9910145427103321 |
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Titolo |
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) : 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei / / compiled by Institute of Electrical and Electronics Engineers |
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Pubbl/distr/stampa |
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Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2008 |
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ISBN |
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1-5090-8060-0 |
1-4244-3624-9 |
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Descrizione fisica |
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1 online resource (423 pages) |
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Disciplina |
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Soggetti |
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Microelectronic packaging |
Microelectromechanical systems |
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Lingua di pubblicazione |
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Formato |
Materiale a stampa |
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Livello bibliografico |
Monografia |
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