Electronic packaging and corrosion in microelectronics : : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987 / edited by Morris E. Nicholson sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota
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| Autore: | Conference on Electronic Packaging : Materials and Processes & Corrosion in Microelectronics : 3rd : <1987 |
| Titolo: | Electronic packaging and corrosion in microelectronics : : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987 / edited by Morris E. Nicholson sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota |
| Pubblicazione: | [Metals Park, Ohio] : ASM International, 1987 |
| Descrizione fisica: | VIII, 296 p. : ill. ; 29 cm |
| Disciplina: | 621 |
| Soggetto non controllato: | Imballaggi |
| Altri autori: | Nicholson, Morris E. |
| Note generali: | Includes bibliographies. |
| ISBN: | 0871702916 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 990010033310403321 |
| Lo trovi qui: | Univ. Federico II |
| Collocazione: | 14 P.026.004 |
| Opac: | Controlla la disponibilità qui |