LEADER 01452nam0-2200337---450-
001 990010033310403321
005 20160128103816.0
010   $a0871702916
035   $a001003331
035   $aFED01001003331
035   $a(Aleph)001003331FED01
035   $a001003331
100   $a20160128d1987----km-y0itay50------ba
101 0 $aeng
102   $aUS
105   $a--------001yy
200 1 $aElectronic packaging and corrosion in microelectronics :$eproceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987$fedited by Morris E. Nicholson sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota
210   $a[Metals Park, Ohio]$cASM International$d1987
215   $aVIII, 296 p.$cill.$d29 cm
300   $aIncludes bibliographies.
610 0 $aImballaggi
676   $a621
701  1$aNicholson$bMorris E.
710 12$aConference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics$d3rd$f<1987$eMinneapolis, Minn.>
711 12$aASM International$bElectronic Materials and Processing Division$eUniversity of Minnesota.
801  0$aIT$bUNINA$gRICA$2UNIMARC
901   $aBK
912   $a990010033310403321
952   $a14 P.026.004$b2347$fDINMP
959   $aDINMP
997   $aUNINA