Interconnect technology for 32 NM and beyond / / Jeff Gambino
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| Autore: |
Gambino Jeff
|
| Titolo: |
Interconnect technology for 32 NM and beyond / / Jeff Gambino
|
| Pubblicazione: | [United States] : , : IEEE, , 2008 |
| Descrizione fisica: | 1 online resource (1 video file, 60 mins) : color illustrations |
| Disciplina: | 537.24 |
| Soggetto topico: | Dielectrics |
| Electroplating | |
| Sommario/riassunto: | This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described. |
| Titolo autorizzato: | Interconnect technology for 32 NM and beyond |
| ISBN: | 1-5090-8952-7 |
| Formato: | Videoregistrazioni  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910144962403321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |