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181   $ctdi$2rdacontent
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182   $cc$2rdamedia
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200 10$aInterconnect technology for 32 NM and beyond /$fJeff Gambino
210  1$a[United States] :$cIEEE,$d2008.
215   $a1 online resource (1 video file, 60 mins) $ccolor illustrations
311   $a1-4244-1446-6 
311   $a1-4244-1447-4 
330   $aThis tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.
606   $aDielectrics
606   $aElectroplating
615  0$aDielectrics.
615  0$aElectroplating.
676   $a537.24
700   $aGambino$b Jeff$0845395
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801  1$bIEEE
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996   $aInterconnect technology for 32 NM and beyond$91886779
997   $aUNINA