Vai al contenuto principale della pagina

Handbook of wafer bonding [[electronic resource] /] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo



(Visualizza in formato marc)    (Visualizza in BIBFRAME)

Titolo: Handbook of wafer bonding [[electronic resource] /] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo Visualizza cluster
Pubblicazione: Weinheim, Germany, : Wiley-VCH, 2012
Descrizione fisica: 1 online resource (430 p.)
Disciplina: 621.38152
Soggetto topico: Semiconductors - Bonding
Semiconductor wafers
Microelectromechanical systems - Design and construction
Altri autori: RammPeter  
LuJames Jian-Qiang  
TakloMaaike M. V  
Note generali: Description based upon print version of record.
Nota di bibliografia: Includes bibliographical references and index.
Nota di contenuto: pt. 1. Technologies -- pt. 2. Applications.
Sommario/riassunto: Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.
Titolo autorizzato: Handbook of wafer bonding  Visualizza cluster
ISBN: 3-527-64423-7
1-280-66282-4
9786613639752
3-527-64422-9
3-527-64424-5
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910139699603321
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui