LEADER 02515nam 2200637 a 450 001 9910139699603321 005 20230802004451.0 010 $a3-527-64423-7 010 $a1-280-66282-4 010 $a9786613639752 010 $a3-527-64422-9 010 $a3-527-64424-5 035 $a(CKB)2550000000082805 035 $a(EBL)822735 035 $a(OCoLC)775301857 035 $a(SSID)ssj0000636248 035 $a(PQKBManifestationID)11367416 035 $a(PQKBTitleCode)TC0000636248 035 $a(PQKBWorkID)10660850 035 $a(PQKB)10156491 035 $a(MiAaPQ)EBC822735 035 $a(Au-PeEL)EBL822735 035 $a(CaPaEBR)ebr10529302 035 $a(CaONFJC)MIL363975 035 $a(EXLCZ)992550000000082805 100 $a20120218d2012 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHandbook of wafer bonding$b[electronic resource] /$fedited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo 210 $aWeinheim, Germany $cWiley-VCH$d2012 215 $a1 online resource (430 p.) 300 $aDescription based upon print version of record. 311 $a3-527-32646-4 320 $aIncludes bibliographical references and index. 327 $apt. 1. Technologies -- pt. 2. Applications. 330 $aWritten by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. 606 $aSemiconductors$xBonding$vHandbooks, manuals, etc 606 $aSemiconductor wafers 606 $aMicroelectromechanical systems$xDesign and construction 615 0$aSemiconductors$xBonding 615 0$aSemiconductor wafers. 615 0$aMicroelectromechanical systems$xDesign and construction. 676 $a621.38152 701 $aRamm$b Peter$0885853 701 $aLu$b James Jian-Qiang$0885854 701 $aTaklo$b Maaike M. V$0885855 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910139699603321 996 $aHandbook of wafer bonding$91977959 997 $aUNINA