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International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong



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Titolo: International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong Visualizza cluster
Pubblicazione: [Place of publication not identified], : IEEE, 2000
Disciplina: 621.381/046
Soggetto topico: Electronic packaging
Electrical & Computer Engineering
Electrical Engineering
Engineering & Applied Sciences
Note generali: Bibliographic Level Mode of Issuance: Monograph
Titolo autorizzato: International Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong  Visualizza cluster
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 996215173303316
Lo trovi qui: Univ. di Salerno
Opac: Controlla la disponibilità qui
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