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100   $a20160829d2000      uy              
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$aInternational Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong
210 31$a[Place of publication not identified]$cIEEE$d2000
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a0-7803-6654-9 
606   $aElectronic packaging$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aHong Kong University of Science and Technology Department of Mechanical Engineering.
712 02$aInstitute of Electrical and Electronics Engineers
712 02$aEPACK LAB
801  0$bPQKB
906   $aPROCEEDING
912   $a996215173303316
996   $aInternational Symposium on Electronic Materials and Packaging (EMAP2000) : November 30-December 2, 2000, Hong Kong$92519516
997   $aUNISA