Defective heat sink adhesive and seismically induced chatter in relays within printed circuit cards
(Visualizza in formato marc)
(Visualizza in BIBFRAME)
| Titolo: |
Defective heat sink adhesive and seismically induced chatter in relays within printed circuit cards
|
| Pubblicazione: | Washington, D.C. : , : United States Nuclear Regulatory Commission, Office of Inspection and Enforcement, , 1983 |
| Descrizione fisica: | 1 online resource |
| Soggetto topico: | Heat sinks (Electronics) - Defects |
| Electric relays | |
| Smart cards | |
| Heat sinks (Electronics) | |
| Note generali: | "June 13, 1983." |
| Titolo autorizzato: | Defective heat sink adhesive and seismically induced chatter in relays within printed circuit cards |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910713950403321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |