LEADER 01387nam  2200397   450 
001 9910713950403321
005 20201014111236.0
035   $a(CKB)5470000002506159
035   $a(OCoLC)1200232829
035   $a(EXLCZ)995470000002506159
100   $a20201014d1983      ua             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aDefective heat sink adhesive and seismically induced chatter in relays within printed circuit cards
210  1$aWashington, D.C. :$cUnited States Nuclear Regulatory Commission, Office of Inspection and Enforcement,$d1983.
215   $a1 online resource
225 1 $aInformation notice ;$v83-38
300   $a"June 13, 1983."
606   $aHeat sinks (Electronics)$xDefects
606   $aElectric relays
606   $aSmart cards
606   $aHeat sinks (Electronics)$2fast
615  0$aHeat sinks (Electronics)$xDefects.
615  0$aElectric relays.
615  0$aSmart cards.
615  7$aHeat sinks (Electronics)
712 02$aU.S. Nuclear Regulatory Commission.$bOffice of Inspection and Enforcement,
801  0$bGPO
801  1$bGPO
906   $aBOOK
912   $a9910713950403321
996   $aDefective heat sink adhesive and seismically induced chatter in relays within printed circuit cards$93266631
997   $aUNINA