3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / / edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis

• Pubblicazione: Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016
• Edizione: 1st ed. 2016.
• Descrizione fisica: 1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.)
• Disciplina: 621.3815
• Soggetto topico: Electronic circuits; Microprocessors; Circuits and Systems; Electronic Circuits and Devices; Processor Architectures
• Persona (resp. second.): ElfadelIbrahim (Abe) M; FettweisGerhard
• Nota di bibliografia: Includes bibliographical references at the end of each chapters and index.
• Nota di contenuto: Introduction to Electrical 3D Integration -- Copper-based TSV – Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
• Sommario/riassunto: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; •Includes discussion of 3D integration of high-density power sources and novel NVM.
• Titolo autorizzato: 3D Stacked Chips
• ISBN: 3-319-20481-5
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910254242703321
• Lo trovi qui: Univ. Federico II