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010   $a3-319-20481-5
024 7 $a10.1007/978-3-319-20481-9
035   $a(CKB)3710000000667101
035   $a(DE-He213)978-3-319-20481-9
035   $a(MiAaPQ)EBC4526846
035   $a(PPN)194078426
035   $a(EXLCZ)993710000000667101
100   $a20160511d2016      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$a3D Stacked Chips $eFrom Emerging Processes to Heterogeneous Systems /$fedited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
205   $a1st ed. 2016.
210  1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2016.
215   $a1 online resource (XXIII, 339 p. 238 illus., 157 illus. in color.) 
311 08$a3-319-20480-7 
320   $aIncludes bibliographical references at the end of each chapters and index.
327   $aIntroduction to Electrical 3D Integration -- Copper-based TSV ? Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
330   $aThis book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   ?Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; ?Explains the use of wireless 3D integration to improve 3D IC reliability and yield; ?Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; ?Includes discussion of 3D integration of high-density power sources and novel NVM.
606   $aElectronic circuits
606   $aMicroprocessors
606   $aComputer architecture
606   $aElectronic Circuits and Systems
606   $aProcessor Architectures
615  0$aElectronic circuits.
615  0$aMicroprocessors.
615  0$aComputer architecture.
615 14$aElectronic Circuits and Systems.
615 24$aProcessor Architectures.
676   $a621.3815
702   $aElfadel$b Ibrahim (Abe) M$4edt$4http://id.loc.gov/vocabulary/relators/edt
702   $aFettweis$b Gerhard$4edt$4http://id.loc.gov/vocabulary/relators/edt
906   $aBOOK
912   $a9910254242703321
996   $a3D Stacked Chips$91539937
997   $aUNINA