Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics : Odaiba, Tokyo, Japan, January 15-18, 2007 s / / IEEE Components, Packaging and Manufacturing Technology Society

• Pubblicazione: IEEE
• Soggetto topico: Microelectronic packaging - Materials; Polymers; Integrated circuits - Reliability; Photonics - Materials; Polymeric composites
• Titolo abbreviato (Periodici): POLMYERS & ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ON; POLMYERS AND ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ON; POLYMERS & ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2007. POLYTRONIC 2007. 6TH INTERNATIONAL CONFERENCE ON
• Altri titoli varianti: Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics; Electronics Communications and Computers
• Titolo autorizzato: Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics
• ISBN: 9781509089925; 1509089926
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 9910143022403321
• Lo trovi qui: Univ. Federico II