01958oam 2200433z- 450 991014302240332120241212215529.097815090899251509089926(CKB)1000000000331791(EXLCZ)99100000000033179120220614c2007uuuu -u- -engPolytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Odaiba, Tokyo, Japan, January 15-18, 2007 s /IEEE Components, Packaging and Manufacturing Technology SocietyIEEE9781424411306 1424411300 9781424411863 1424411866 Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and PhotonicsElectronics Communications and Computers POLMYERS & ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ONPOLMYERS AND ADHESIVES IN MICROELECTRONICS & PHOTONICS, POLYTRONIC 2007 - 6TH INTERNATIONAL CONFERENCE ONPOLYMERS & ADHESIVES IN MICROELECTRONICS AND PHOTONICS, 2007. POLYTRONIC 2007. 6TH INTERNATIONAL CONFERENCE ONMicroelectronic packagingMaterialsCongressesPolymersCongressesIntegrated circuitsReliabilityCongressesPhotonicsMaterialsCongressesPolymeric compositesCongressesMicroelectronic packagingMaterialsPolymersIntegrated circuitsReliabilityPhotonicsMaterialsPolymeric compositesInstitute of Electrical and Electronics Engineers.PROCEEDING9910143022403321Polytronic 2006 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics2871620UNINA