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| Titolo: |
Integrated circuits, photodiodes and organic field effect transistors [[electronic resource] /] / Robert McIntire and Pierre Donnell, editors
|
| Pubblicazione: | New York, : Nova Science Publishers, c2009 |
| Descrizione fisica: | 1 online resource (458 p.) |
| Disciplina: | 621.3815 |
| Soggetto topico: | Diodes |
| Organic field-effect transistors | |
| Soggetto genere / forma: | Electronic books. |
| Altri autori: |
McIntireRobert
DonnellPierre
|
| Note generali: | Description based upon print version of record. |
| Nota di bibliografia: | Includes bibliographical references and index. |
| Nota di contenuto: | ""INTEGRATED CIRCUITS,PHOTODIODES AND ORGANIC FIELDEFFECT TRANSISTORS""; ""CONTENTS""; ""PREFACE""; ""RESEARCH AND REVIEW STUDIES""; ""METAMATERIALS TECHNOLOGY: APPLICATIONTO RADIOFREQUENCY AND MICROWAVE CIRCUITS""; ""ABSTRACT""; ""1. INTRODUCTION TO METAMATERIALS""; ""2. METAMATERIALS IN PLANAR TECHNOLOGY:METAMATERIAL TRANSMISSION LINES""; ""2.1. The Dual Transmission Line Concept""; ""2.2. CL-Loaded Lines: The Composite Right/Left Handed TransmissionLine Concept""; ""2.3. Resonant Type Metamaterial Transmission Lines""; ""3. APPLICATIONS OF METAMATERIAL TRANSMISSION LINES"" |
| ""3.1. Metamaterial Filters""""3.1.1. Stop Band Filters: Application to Spurious Suppression in ConventionalFilters""; ""3.1.2. Narrow Band Pass Filters and Diplexers""; ""3.1.3. Wide and Ultra Wide Band (UWB) Pass Filters""; ""3.1.4. Metamaterial Based Filters Subjected to Standard Responses:A Design Methodology""; ""3.2. Enhanced Bandwidth Components""; ""3.3. Multiband Components""; ""4. CONCLUSION""; ""REFERENCES""; ""RELIABILITY ASSESSMENT OF INTEGRATEDCIRCUITS AND ITS MISCONCEPTION""; ""ABSTRACT""; ""I. THE IMPORTANCE OF INTEGRATED CIRCUIT RELIABILITY"" | |
| ""II. COMMON RELIABILITY PRACTICES IN INTEGRATEDCIRCUIT INDUSTRY""""1. Process Reliability Test in Wafer Fabrication Manufacturers""; ""2. Product Reliability Tests in IC Assembly and Packaging Manufacturers""; ""3. Highly Accelerated Stress Test (HAST)""; ""III. MISCONCEPTIONS IN COMMON RELIABILITY ASSESSMENTOF INTEGRATED CIRCUITS""; ""1. Zero Failure Represents Good Reliability""; ""2. Higher MTTF Represents Better Reliability""; ""3. MTTF Is the Mean Failure Time""; ""4. Exponential Distribution Is Sufficient to Analyze the Test Data"" | |
| ""5. The Higher the Stress, the More Effective Is the Reliability Test""""A. Masked Failure Mechanism""; ""B. Variation of Failure Mechanism""; ""6. All Test Data Are Valid""; ""7. Only One Failure Mechanism Exist in the Failed Units""; ""8. Probability Plot Is Sufficient for Test Data Analysis""; ""9. Small Sample Size Is Sufficient""; ""10. The Important of Confidence Interval""; ""IV. CONCLUSION""; ""REFERENCES""; ""DESIGN OF A MULTICHANNEL INTEGRATEDBIOSENSOR CHIP AND MICROELECTRONIC SYSTEMFOR EXTRACELLULAR NEURAL RECORDING""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. SYSTEM OVERVIEW"" | |
| ""3. SYSTEM ARCHITECTURE AND DESIGN""""3.1. Neural Signal Input""; ""3.2. Preamplifier Buffers""; ""3.3. Analysis and Design of the Two-Stage Amplifier BasedPreamplifier Buffer""; ""3.3.1. Device Model""; ""3.3.2. Frequency Response and Pole/Zero Locations""; ""3.3.3. Output Swing""; ""3.3.4. Common-Mode Input Range""; ""3.3.5. Internal Slew Rate""; ""3.3.6. External Slew Rate""; ""3.3.7. Systematic Input-Referred Offset Voltage Minimization""; ""3.3.8. Input-Referred Thermal Noise""; ""3.3.9. Preamplifier Buffer Design""; ""3.4. Channels Addressing and Sequencing"" | |
| ""3.5. Biasing Circuitry"" | |
| Titolo autorizzato: | Integrated circuits, photodiodes and organic field effect transistors ![]() |
| ISBN: | 1-61761-868-3 |
| Formato: | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910465406503321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |