Integrated circuits, photodiodes and organic field effect transistors [[electronic resource] /] / Robert McIntire and Pierre Donnell, editors

• Record Nr.: UNINA9910465406503321
• Pubbl/distr/stampa: New York, : Nova Science Publishers, c2009
• ISBN: 1-61761-868-3
• Descrizione fisica: 1 online resource (458 p.)
• Collana: Environmental Research Advances
• Altri autori (Persone): McIntireRobert; DonnellPierre
• Disciplina: 621.3815
• Soggetti: Diodes; Organic field-effect transistors; Electronic books.
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: ""INTEGRATED CIRCUITS,PHOTODIODES AND ORGANIC FIELDEFFECT TRANSISTORS""; ""CONTENTS""; ""PREFACE""; ""RESEARCH AND REVIEW STUDIES""; ""METAMATERIALS TECHNOLOGY: APPLICATIONTO RADIOFREQUENCY AND MICROWAVE CIRCUITS""; ""ABSTRACT""; ""1. INTRODUCTION TO METAMATERIALS""; ""2. METAMATERIALS IN PLANAR TECHNOLOGY:METAMATERIAL TRANSMISSION LINES""; ""2.1. The Dual Transmission Line Concept""; ""2.2. CL-Loaded Lines: The Composite Right/Left Handed TransmissionLine Concept""; ""2.3. Resonant Type Metamaterial Transmission Lines""; ""3. APPLICATIONS OF METAMATERIAL TRANSMISSION LINES""; ""3.1. Metamaterial Filters""""3.1.1. Stop Band Filters: Application to Spurious Suppression in ConventionalFilters""; ""3.1.2. Narrow Band Pass Filters and Diplexers""; ""3.1.3. Wide and Ultra Wide Band (UWB) Pass Filters""; ""3.1.4. Metamaterial Based Filters Subjected to Standard Responses:A Design Methodology""; ""3.2. Enhanced Bandwidth Components""; ""3.3. Multiband Components""; ""4. CONCLUSION""; ""REFERENCES""; ""RELIABILITY ASSESSMENT OF INTEGRATEDCIRCUITS AND ITS MISCONCEPTION""; ""ABSTRACT""; ""I. THE IMPORTANCE OF INTEGRATED CIRCUIT RELIABILITY""; ""II. COMMON RELIABILITY PRACTICES IN INTEGRATEDCIRCUIT INDUSTRY""""1. Process Reliability Test in Wafer Fabrication ; Manufacturers""; ""2. Product Reliability Tests in IC Assembly and Packaging Manufacturers""; ""3. Highly Accelerated Stress Test (HAST)""; ""III. MISCONCEPTIONS IN COMMON RELIABILITY ASSESSMENTOF INTEGRATED CIRCUITS""; ""1. Zero Failure Represents Good Reliability""; ""2. Higher MTTF Represents Better Reliability""; ""3. MTTF Is the Mean Failure Time""; ""4. Exponential Distribution Is Sufficient to Analyze the Test Data""; ""5. The Higher the Stress, the More Effective Is the Reliability Test""""A. Masked Failure Mechanism""; ""B. Variation of Failure Mechanism""; ""6. All Test Data Are Valid""; ""7. Only One Failure Mechanism Exist in the Failed Units""; ""8. Probability Plot Is Sufficient for Test Data Analysis""; ""9. Small Sample Size Is Sufficient""; ""10. The Important of Confidence Interval""; ""IV. CONCLUSION""; ""REFERENCES""; ""DESIGN OF A MULTICHANNEL INTEGRATEDBIOSENSOR CHIP AND MICROELECTRONIC SYSTEMFOR EXTRACELLULAR NEURAL RECORDING""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. SYSTEM OVERVIEW""; ""3. SYSTEM ARCHITECTURE AND DESIGN""""3.1. Neural Signal Input""; ""3.2. Preamplifier Buffers""; ""3.3. Analysis and Design of the Two-Stage Amplifier BasedPreamplifier Buffer""; ""3.3.1. Device Model""; ""3.3.2. Frequency Response and Pole/Zero Locations""; ""3.3.3. Output Swing""; ""3.3.4. Common-Mode Input Range""; ""3.3.5. Internal Slew Rate""; ""3.3.6. External Slew Rate""; ""3.3.7. Systematic Input-Referred Offset Voltage Minimization""; ""3.3.8. Input-Referred Thermal Noise""; ""3.3.9. Preamplifier Buffer Design""; ""3.4. Channels Addressing and Sequencing""; ""3.5. Biasing Circuitry""