Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers
(Visualizza in formato marc)
(Visualizza in BIBFRAME)
| Titolo: |
Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers
|
| Pubblicazione: | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica: | 1 online resource (349 pages) |
| Disciplina: | 621.3815 |
| Soggetto topico: | Integrated circuits |
| Very high speed integrated circuits | |
| Titolo autorizzato: | Proceedings for 2019 IEEE COOL Chips 22 |
| ISBN: | 1-7281-1749-6 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 996580867403316 |
| Lo trovi qui: | Univ. di Salerno |
| Opac: | Controlla la disponibilità qui |