Proceedings for 2019 IEEE COOL Chips 22 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 / / Institute of Electrical and Electronics Engineers

• Record Nr.: UNISA996580867403316
• Pubbl/distr/stampa: Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019
• ISBN: 1-7281-1749-6
• Descrizione fisica: 1 online resource (349 pages)
• Disciplina: 621.3815
• Soggetti: Integrated circuits; Very high speed integrated circuits
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia