2001 IEEE Electrical Performance of Electronic Packaging

• Pubblicazione: [Place of publication not identified], : I E E E, 2001
• Descrizione fisica: 1 online resource (xi, 344 pages) : illustrations
• Disciplina: 621.381/046
• Soggetto topico: Electronic packaging
• Note generali: Bibliographic Level Mode of Issuance: Monograph
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: MONDAY, OCTOBER 29, 2001 -- SESSION I - KEYNOTE -- A Future View of Server Systems (Keynote) 3 (4) -- SESSION II - LOW POWER -- Architectural Approaches to Reducing Power Rtem Costs (Invited Paper) 7 (2) -- ``Watts'' the Matter: Power Reduction Issues (Invited Paper) 9 (2) -- Digital Signal Processors (DSPs) for Low Power Consumption Wireless Applications (Invited Paper) 11 (6) -- SESSION III - RF/MICROWAVE -- Characterization of the Novel Anisotropic Uniplanar Compact Photonic Band-Gap Ground Plane (UC-PBG-GP) 17 (4) -- Measuring Radiation of Small Electronic Equipment in Three-Dimensional TEM Cells 21 (4) -- Effects of Decreasing Extent of Electromagnetic Field at LSI Mounting Area on Radiated Emission from PCB 25 (4) -- Millimeter Wave Package Design: A Comparison of Simulation and Measurement Results 29 (6) -- SESSION IV - TRANSMISSION LINE MODELING -- Recovering Lossy Multiconductor Transmission Line Parameters From Impedance or Scattering Representations 35 (4) -- The Effects of Via Transitions on Differential Signals 39 (4) -- Analysis of Transmission Line Circuits Using Multi-Dimensional Model Reduction Techniques (Student Paper) 43 (4) -- Prime: Passive Realization of Interconnect Models from Measured Data 47 (4) -- Time-Domain Scattering Method Using Triangle Impulse Responses for Modeling Electronic Packaging Components 51 (4) -- Analysis of Transmission Line Structures Using a Dynamic Analysis through WIPL-D 55 (6) -- SESSION V - OPEN FORUM (POSTERS) AND RECEPTION -- Power Distribution -- Reducing Power Bus Impedance at Resonance with Lossy Components (Student Paper) 61 (4) -- Characterization of Via-Induced Parallel-Plate Resonances in a Printed Circuit Board 65 (4) -- Modelling of Multi-Layered Power Supply Planes with Vias 69 (4) -- Characterization of On-Chip Capacitance Effects for I/O Circuits and Core Circuits 73 (4) -- Analysis of Power/Ground Planes by PCB Simulator with Model Order Reduction Technique 77 (4) -- Signal Integrity -- The Use of Loop Inductances in Signal Integrity Modeling 81 (4) -- Design and Verification of Differential Transmission Lines 85 (4) -- Composite Effects of Reflections and Ground Bounce for Signal Line through a Split Power Plane 89 (4) -- Microwave -- Integrated RF Function Architectures in Fully-Organic SOP Technology 93 (4) -- Development of RF/Microwave On-chip Inductors Using an Organic Micromachining Process 97 (4) -- Development of Planar Antennas in Multi-layer Packages for RF-System-on-a-Package Applications 101 (4) -- CPW High Q Inductors on Organic Substrates (Student Paper) 105 (4) -- Microwave Frequency Crosstalk Model of Redistribution Line Patterns of Wafer Level Package 109 (4) -- Measurements -- Robust Extraction of the Frequency-Dependent Characteristic Impedance of Transmission Lines using One-port TDR Measurements - (Student Paper) 113 (4) -- Picosecond-pulse Propagation Measurement on Microstrip Meander Lines Using a Novel Optical Near-Field Mapping Probe (Student Paper) 117 (4) -- Measurement of RF Properties of Glob Top and Under-Encapsulant Materials 121 (4) -- A Broad Band Through-Line-Line De-Embedding Technique for BGA Package Measurements 125 (4) -- A De-embedding Technique for Interconnects 129 (4) -- Characterization of Thin Film Organic Materials at High Frequency 133 (4) -- Complex Dielectric Constant Measurement Techniques for High-Speed Signaling 137 (4) -- Modeling Techniques -- Model Extraction and Waveform Correlation via a Generalized Frequency-and Time-Domain Optimizer 141 (4) -- Equivalent Circuit Representation and Dimension Reduction Technique for Efficient FDTD Modeling of Power/Ground Plane (Student Paper) 145 (4) -- Modelling Complex Via Hole Structures 149 (4) -- Comparison Between Chebyshev and Power Series Expansion Functions for Interpolating Data 153 (4) -- Field Analysis in Inhomogeneously-Filled Stripline Circuits 157 (4) -- Modeling of Multi-vias Coupling for High Speed Interconnects 161 (4) -- Fast Capacitance Extraction of Conductors Embedded in a Layered Medium (Student Paper) 165 (4) -- Modeling of Interconnects and Electromagnetic Field Distributions Using FDTD Method 169 (4) -- Reduced-Order Models based on Measured S-Parameters for Time-Frequency Analysis of Microwave Circuits using Genetic Algorithms 173 (4) -- An Iteration-Free Fast Multilevel Solver for Dense Method of Moment Systems 177 (4) -- Fast Electromagnetic Modeling for Electronic Packaging in Layered Media 181 (4) -- An Alternating Implicit Block Overlapped FDTD (AIBO-FDTD) Method and Its Estimation with Parallel Computation 185 (4) -- Crosstalk for Curvilinear Conductors by Utilising a Nonuniform Transmission Line Approach 189 (4) -- Unit Cell Modeling of Meander Delay Line based on Finite-Difference Time-Domain Method and Floquet's Theorem (Student Paper) 193 (6) -- TUESDAY, OCTOBER 30, 2001 -- SESSION VI - POWER DISTRIBUTION -- Simulations of Frequency Dependencies of Delta-I Noise 199 (4) -- Simultaneous Switching Noise Analysis on Bus Lines Using Coupled Circuit and Electromagnetic Simulation 203 (4) -- Analysis of Multi-Layered Irregular Power Distribution Planes with Vias Using Transmission Matrix Method (Student Paper) 207 (4) -- An Approach to Measuring Power Supply Impedance of Microprocessors 211 (4) -- Powering Intel® Pentium® 4 Generation Processors 215 (6) -- SESSION VII - EM MODELING -- Flat Package Industance Extraction with Ground Plane Current Precalculation (Student Paper) 221 (4) -- Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes 225 (4) -- Efficient Construction of Two-Port Passive Macromodels for Resonant Network (Student Paper) 229 (4) -- Coupled Electromagnetic-Circuit Simulation of Arbitraily-Shaped Conducting Structures 233 (4) -- New Efficient Method of Modeling Electronics Packages with Power and Ground Planes 237 (6) -- SESSION VIII - MODEL ORDER REDUCTION -- Recent Advances in Reduced-Order Modeling of Complex Interconnects 243 (4) -- Physically Consistent Transmission Line Models For High-Speed Interconnects in Lossy Dielectrics 247 (4) -- Triangle Impulse Response (TIR) Calculation for Lossy Transmission Line Simulation (Student Paper) 251 (4) -- A Comparative Study of Two Transient Analysis Algorithms for Lossy Transmission Lines with Frequency-Dependent Data 255 (4) -- Global Multi-Level Reduction Technique for Nonlinear Simulation of High-Speed Interconnect Circuits (Student Paper) 259 (6) -- SESSION IX - POWER DECOUPLING -- Modeling Shared-Via Decoupling in a Multi-Layered Structure using the CEMPIE Approach 265 (4) -- ARIES: Using Annual-Ring Embedded Resistors to Set Capacitor ESR in Power Distribution Networks 269 (4) -- Design Oriented Analysis of Package Power Distribution System Considering Target Impedance for High Performance Microprocessors 273 (4) -- Effective Decoupling Radius of Decoupling Capacitor 277 (6) -- WEDNESDAY, OCTOBER 31, 2001 -- SESSION X - SYSTEM DESIGN -- Modeling and Measurement of the Alpha 21364 Package 283 (4) -- SI and Design Considerations for Gbps PCBs In Communication Systems 287 (4) -- Design and Performance Evaluation of Pentium® III Microprocessor Packaging 291 (4) -- Design Optimization Methodology for Simultaneous Bidirectional Interface 295 (4) -- High Bandwidth Low Latency Chip To Chip Interconnects Using High Performance MLC Glass Ceramic Power4R MCM 299 (4) -- A Novel Efficient Approach of Including Frequency-Dependent Power Delivery Effects in Bus Signal Integrity Simulation 303 (6) -- SESSION XI - MEASUREMENT -- Package Model Extraction from Multi-port S-parameters 309 (4) -- Understanding Modeling and Measurements of Differential Transmission Lines 313 (4) -- Experimental Study of the Ground Plane in Asymmetric Coupled Silicon Lines 317 (4) -- High Sensitivity Magnetic Near Field Probe Based on Ferromagnetic Thin-Film Technology 321 (6) -- SESSION XII - MODELING -- Solution Space Analysis of ; Interconnects for Low Voltage Differential Signaling (LVDS) Applications 327 (4) -- Behavioral Modeling of Digital IC Input and Output Ports 331 (4) -- Accurate Closed-Forum Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate 335 (4) -- RF Modeling of Vertical Interconnection Between Power-Ground Plane Combined with 2D TLM 339 (4) -- Author Index 343.
• Titolo autorizzato: 2001 IEEE Electrical Performance of Electronic Packaging
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Lingua di pubblicazione: Inglese
• Record Nr.: 996213505003316
• Lo trovi qui: Univ. di Salerno