2001 IEEE Electrical Performance of Electronic Packaging

• Record Nr.: UNISA996213505003316
• Pubbl/distr/stampa: [Place of publication not identified], : I E E E, 2001
• Descrizione fisica: 1 online resource (xi, 344 pages) : illustrations
• Disciplina: 621.381/046
• Soggetti: Electronic packaging
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Bibliographic Level Mode of Issuance: Monograph
• Nota di bibliografia: Includes bibliographical references and index.
• Nota di contenuto: MONDAY, OCTOBER 29, 2001 -- SESSION I - KEYNOTE -- A Future View of Server Systems (Keynote) 3 (4) -- SESSION II - LOW POWER -- Architectural Approaches to Reducing Power Rtem Costs (Invited Paper) 7 (2) -- ``Watts'' the Matter: Power Reduction Issues (Invited Paper) 9 (2) -- Digital Signal Processors (DSPs) for Low Power Consumption Wireless Applications (Invited Paper) 11 (6) -- SESSION III - RF/MICROWAVE -- Characterization of the Novel Anisotropic Uniplanar Compact Photonic Band-Gap Ground Plane (UC-PBG-GP) 17 (4) -- Measuring Radiation of Small Electronic Equipment in Three-Dimensional TEM Cells 21 (4) -- Effects of Decreasing Extent of Electromagnetic Field at LSI Mounting Area on Radiated Emission from PCB 25 (4) -- Millimeter Wave Package Design: A Comparison of Simulation and Measurement Results 29 (6) -- SESSION IV - TRANSMISSION LINE MODELING -- Recovering Lossy Multiconductor Transmission Line Parameters From Impedance or Scattering Representations 35 (4) -- The Effects of Via Transitions on Differential Signals 39 (4) -- Analysis of Transmission Line Circuits Using Multi-Dimensional Model Reduction Techniques (Student Paper) 43 (4) -- Prime: Passive Realization of Interconnect Models from Measured Data 47 (4) -- Time-Domain Scattering Method Using Triangle Impulse Responses for Modeling Electronic Packaging Components 51 (4) -- Analysis of Transmission Line Structures Using a Dynamic Analysis through WIPL-D 55 (6) -- SESSION V - OPEN FORUM (POSTERS) AND RECEPTION -- Power Distribution -- Reducing Power Bus Impedance at Resonance with ; Lossy Components (Student Paper) 61 (4) -- Characterization of Via-Induced Parallel-Plate Resonances in a Printed Circuit Board 65 (4) -- Modelling of Multi-Layered Power Supply Planes with Vias 69 (4) -- Characterization of On-Chip Capacitance Effects for I/O Circuits and Core Circuits 73 (4) -- Analysis of Power/Ground Planes by PCB Simulator with Model Order Reduction Technique 77 (4) -- Signal Integrity -- The Use of Loop Inductances in Signal Integrity Modeling 81 (4) -- Design and Verification of Differential Transmission Lines 85 (4) -- Composite Effects of Reflections and Ground Bounce for Signal Line through a Split Power Plane 89 (4) -- Microwave -- Integrated RF Function Architectures in Fully-Organic SOP Technology 93 (4) -- Development of RF/Microwave On-chip Inductors Using an Organic Micromachining Process 97 (4) -- Development of Planar Antennas in Multi-layer Packages for RF-System-on-a-Package Applications 101 (4) -- CPW High Q Inductors on Organic Substrates (Student Paper) 105 (4) -- Microwave Frequency Crosstalk Model of Redistribution Line Patterns of Wafer Level Package 109 (4) -- Measurements -- Robust Extraction of the Frequency-Dependent Characteristic Impedance of Transmission Lines using One-port TDR Measurements - (Student Paper) 113 (4) -- Picosecond-pulse Propagation Measurement on Microstrip Meander Lines Using a Novel Optical Near-Field Mapping Probe (Student Paper) 117 (4) -- Measurement of RF Properties of Glob Top and Under-Encapsulant Materials 121 (4) -- A Broad Band Through-Line-Line De-Embedding Technique for BGA Package Measurements 125 (4) -- A De-embedding Technique for Interconnects 129 (4) -- Characterization of Thin Film Organic Materials at High Frequency 133 (4) -- Complex Dielectric Constant Measurement Techniques for High-Speed Signaling 137 (4) -- Modeling Techniques -- Model Extraction and Waveform Correlation via a Generalized Frequency-and Time-Domain Optimizer 141 (4) -- Equivalent Circuit Representation and Dimension Reduction Technique for Efficient FDTD Modeling of Power/Ground Plane (Student Paper) 145 (4) -- Modelling Complex Via Hole Structures 149 (4) -- Comparison Between Chebyshev and Power Series Expansion Functions for Interpolating Data 153 (4) -- Field Analysis in Inhomogeneously-Filled Stripline Circuits 157 (4) -- Modeling of Multi-vias Coupling for High Speed Interconnects 161 (4) -- Fast Capacitance Extraction of Conductors Embedded in a Layered Medium (Student Paper) 165 (4) -- Modeling of Interconnects and Electromagnetic Field Distributions Using FDTD Method 169 (4) -- Reduced-Order Models based on Measured S-Parameters for Time-Frequency Analysis of Microwave Circuits using Genetic Algorithms 173 (4) -- An Iteration-Free Fast Multilevel Solver for Dense Method of Moment Systems 177 (4) -- Fast Electromagnetic Modeling for Electronic Packaging in Layered Media 181 (4) -- An Alternating Implicit Block Overlapped FDTD (AIBO-FDTD) Method and Its Estimation with Parallel Computation 185 (4) -- Crosstalk for Curvilinear Conductors by Utilising a Nonuniform Transmission Line Approach 189 (4) -- Unit Cell Modeling of Meander Delay Line based on Finite-Difference Time-Domain Method and Floquet's Theorem (Student Paper) 193 (6) -- TUESDAY, OCTOBER 30, 2001 -- SESSION VI - POWER DISTRIBUTION -- Simulations of Frequency Dependencies of Delta-I Noise 199 (4) -- Simultaneous Switching Noise Analysis on Bus Lines Using Coupled Circuit and Electromagnetic Simulation 203 (4) -- Analysis of Multi-Layered Irregular Power Distribution Planes with Vias Using Transmission Matrix Method (Student Paper) 207 (4) -- An Approach to Measuring Power Supply ; Impedance of Microprocessors 211 (4) -- Powering Intel® Pentium® 4 Generation Processors 215 (6) -- SESSION VII - EM MODELING -- Flat Package Industance Extraction with Ground Plane Current Precalculation (Student Paper) 221 (4) -- Generalized PEEC Models for Three-Dimensional Interconnect Structures and Integrated Passives of Arbitrary Shapes 225 (4) -- Efficient Construction of Two-Port Passive Macromodels for Resonant Network (Student Paper) 229 (4) -- Coupled Electromagnetic-Circuit Simulation of Arbitraily-Shaped Conducting Structures 233 (4) -- New Efficient Method of Modeling Electronics Packages with Power and Ground Planes 237 (6) -- SESSION VIII - MODEL ORDER REDUCTION -- Recent Advances in Reduced-Order Modeling of Complex Interconnects 243 (4) -- Physically Consistent Transmission Line Models For High-Speed Interconnects in Lossy Dielectrics 247 (4) -- Triangle Impulse Response (TIR) Calculation for Lossy Transmission Line Simulation (Student Paper) 251 (4) -- A Comparative Study of Two Transient Analysis Algorithms for Lossy Transmission Lines with Frequency-Dependent Data 255 (4) -- Global Multi-Level Reduction Technique for Nonlinear Simulation of High-Speed Interconnect Circuits (Student Paper) 259 (6) -- SESSION IX - POWER DECOUPLING -- Modeling Shared-Via Decoupling in a Multi-Layered Structure using the CEMPIE Approach 265 (4) -- ARIES: Using Annual-Ring Embedded Resistors to Set Capacitor ESR in Power Distribution Networks 269 (4) -- Design Oriented Analysis of Package Power Distribution System Considering Target Impedance for High Performance Microprocessors 273 (4) -- Effective Decoupling Radius of Decoupling Capacitor 277 (6) -- WEDNESDAY, OCTOBER 31, 2001 -- SESSION X - SYSTEM DESIGN -- Modeling and Measurement of the Alpha 21364 Package 283 (4) -- SI and Design Considerations for Gbps PCBs In Communication Systems 287 (4) -- Design and Performance Evaluation of Pentium® III Microprocessor Packaging 291 (4) -- Design Optimization Methodology for Simultaneous Bidirectional Interface 295 (4) -- High Bandwidth Low Latency Chip To Chip Interconnects Using High Performance MLC Glass Ceramic Power4R MCM 299 (4) -- A Novel Efficient Approach of Including Frequency-Dependent Power Delivery Effects in Bus Signal Integrity Simulation 303 (6) -- SESSION XI - MEASUREMENT -- Package Model Extraction from Multi-port S-parameters 309 (4) -- Understanding Modeling and Measurements of Differential Transmission Lines 313 (4) -- Experimental Study of the Ground Plane in Asymmetric Coupled Silicon Lines 317 (4) -- High Sensitivity Magnetic Near Field Probe Based on Ferromagnetic Thin-Film Technology 321 (6) -- SESSION XII - MODELING -- Solution Space Analysis of; Interconnects for Low Voltage Differential Signaling (LVDS) Applications 327 (4) -- Behavioral Modeling of Digital IC Input and Output Ports 331 (4) -- Accurate Closed-Forum Expressions for the Frequency-Dependent Line Parameters of Coupled On-Chip Interconnects on Silicon Substrate 335 (4) -- RF Modeling of Vertical Interconnection Between Power-Ground Plane Combined with 2D TLM 339 (4) -- Author Index 343.

Histophilus somni : Biology, Molecular Basis of Pathogenesis, and Host Immunity / / edited by Thomas J. Inzana

• Record Nr.: UNINA9910253886403321
• Pubbl/distr/stampa: Cham : , : Springer International Publishing : , : Imprint : Springer, , 2016
• ISBN: 3-319-29556-X
• Edizione: [1st ed. 2016.]
• Descrizione fisica: 1 online resource (165 p.)
• Collana: Current Topics in Microbiology and Immunology, , 0070-217X ; ; 396
• Disciplina: 636.0896014
• Soggetti: Medical microbiology; Veterinary medicine; Bacteriology; Medical Microbiology; Veterinary Medicine/Veterinary Science
• Lingua di pubblicazione: Inglese
• Formato: Materiale a stampa
• Livello bibliografico: Monografia
• Note generali: Description based upon print version of record.
• Nota di bibliografia: Includes bibliographical references at the end of each chapters.
• Nota di contenuto: Taxonomy of Histophilus somni -- Histophilosis as a Natural Disease -- Histophilus somni Genomics and Genetics -- Interactions on Histophilus somni with Host Cells -- Histophilus somni Surface Proteins -- Host Immune Response to Histophilus somni -- The Many Facets of Lipooligosaccharide as a Virulence Factor of Histophilus somni -- Exopolysaccharide Production and Biofilm Formation by Histophilus somni.
• Sommario/riassunto: This volume reviews the current understanding of the taxonomy, disease syndromes, genetics, biology, and pathogenic factors of Histophilus somni, as well as the host immune response to this pathogen. H. somni is one of the most important bacterial pathogens in cattle and other ruminants, and its virulence factors are highly conserved with Haemophilus influenzae and other members of the Pasteurellaceae. H. somni has been recognized as a major cause of thrombotic meningoencephalitis, respiratory disease syndromes, myocarditis, reproductive disease syndromes, polyarthritis, mastitis, ocular disease, and septicemia. The only known habitats of H. somni are the mucosal surfaces of ruminants, making this bacterium an ; opportunistic pathogen. Although it is capable of causing inflammation at systemic sites and is toxic to epithelial and phagocytic cells, the bacterium’s wide array of virulence factors act primarily as a defense against, or to escape recognition from, host innate and adaptive immunity.