10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
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| Titolo: |
10th IEEE Workshop on Signal Propagation on Interconnects : May 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings / / co-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
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| Pubblicazione: | IEEE |
| Disciplina: | 621.3815/31 |
| Soggetto topico: | Printed circuits |
| Interconnects (Integrated circuit technology) | |
| Signal theory (Telecommunication) | |
| Altri titoli varianti: | 2006 IEEE Workship on Signal Propagation on Interconnects |
| Systems, Man and Cybernetics | |
| Titolo autorizzato: | 10th IEEE Workshop on Signal Propagation on Interconnects |
| ISBN: | 1-5090-9224-2 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910142665303321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |