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100   $a20220608c2006uuuu  -u-         -
101 0 $aeng
200 10$a10th IEEE Workshop on Signal Propagation on Interconnects $eMay 09-12, 2006, "Dorint Sofitel Schweizerhof Berlin", Berlin, Germany : proceedings /$fco-sponsored by IEEE Components, Packaging and Manufacturing Technology Society (CPMT), Technical Committee on Electrical Design, Modeling and Simulation (TC-EMDS) [i.e. TC-EDMS], and by IEEE Computer Society, Test Technology Technical Council (TTTC)
210   $cIEEE
311 08$a9781424404544 
311 08$a1424404541 
311 08$a9781424404551 
311 08$a142440455X 
517   $a2006 IEEE Workship on Signal Propagation on Interconnects
517   $aSystems, Man and Cybernetics 
606   $aPrinted circuits$vCongresses
606   $aInterconnects (Integrated circuit technology)$vCongresses
606   $aSignal theory (Telecommunication)$vCongresses
615  0$aPrinted circuits
615  0$aInterconnects (Integrated circuit technology)
615  0$aSignal theory (Telecommunication)
676   $a621.3815/31
712 02$aComponents, Packaging & Manufacturing Technology Society.$bTechnical Committee on Electrical Design, Modeling and Simulation.
712 02$aIEEE Computer Society.$bTechnical Council on Test Technology.
906   $aPROCEEDING
912   $a9910142665303321
996   $a10th IEEE Workshop on Signal Propagation on Interconnects$92872422
997   $aUNINA