2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) : October 5-11,2021, online / / Institute of Electrical and Electronics Engineers
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| Titolo: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) : October 5-11,2021, online / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway, New Jersey : , : IEEE, , [2021] |
| ©2021 | |
| Descrizione fisica: | 1 online resource (i, 53 pages) : illustrations |
| Disciplina: | 621.36 |
| Soggetto topico: | Photonics - Materials |
| Sommario/riassunto: | This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers presenting new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies. |
| Altri titoli varianti: | 2021 7th International Workshop on Low Temperature Bonding for 3D Integration |
| Titolo autorizzato: | 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| ISBN: | 1-66540-567-8 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910554051103321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |