01709nam 2200361 450 991055405110332120230421082512.01-66540-567-8(CKB)4100000012153965(NjHacI)994100000012153965(EXLCZ)99410000001215396520230421d2021 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) October 5-11,2021, online /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :IEEE,[2021]©20211 online resource (i, 53 pages) illustrations1-66540-568-6 This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers presenting new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies.2021 7th International Workshop on Low Temperature Bonding for 3D Integration PhotonicsMaterialsCongressesPhotonicsMaterials621.36NjHacINjHaclPROCEEDING99105540511033212021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)2811980UNINA