2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
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| Titolo: |
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems : 24-27 March 2019, Hannover, Germany / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica: | 1 online resource (78 pages) |
| Disciplina: | 621.381011 |
| Soggetto topico: | Microelectronics - Simulation methods |
| Systems engineering - Simulation methods | |
| Titolo autorizzato: | 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
| ISBN: | 1-5386-8040-8 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 9910325656903321 |
| Lo trovi qui: | Univ. Federico II |
| Opac: | Controlla la disponibilità qui |