Analog/RF and mixed-signal circuit systematic design / / Mourad Fakhfakh, Esteban Tlelo-Cuautle, and Rafael Castro-Lopez (eds.) |
Edizione | [1st ed. 2013.] |
Pubbl/distr/stampa | Berlin ; ; New York, : Springer, c2013 |
Descrizione fisica | 1 online resource (xii, 379 pages) : illustrations (some color) |
Disciplina | 621.3815 |
Altri autori (Persone) |
FakhfakhMourad
Tlelo-CuautleEsteban Castro-LopezR |
Collana | Lecture notes in electrical engineering |
Soggetto topico |
Linear integrated circuits - Design and construction
Radio frequency integrated circuits - Design and construction Systems on a chip - Design and construction |
ISBN | 3-642-36329-6 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
""Title ""; ""Foreword""; ""Preface""; ""Contents""; ""Part I Methodologies""; ""Towards Automatic Structural Analysis of Mixed-Signal Circuits""; ""Introduction""; ""Preprocessing""; ""Building Block Recognition""; ""Analog, Mixed-Signal and Digital Building Block Library""; ""Recognition Conflicts and Their Resolution""; ""Recognition Algorithm""; ""Structural Signal Flow Analysis""; ""Generation""; ""Assignment of Pass�Gate Directions""; ""Analog / Digital Partitioning""; ""Transformation to Temporal ESFG""; ""Logic Function Extraction""
""Computation of Logic Function for Building Blocks""""Computation of Overall Logic Function""; ""Application Examples""; ""Description Generation for Digital Standard Cell Libraries""; ""Structural Analysis of Mixed-Signal Circuits""; ""Conclusion""; ""References""; ""Efficient Synthesis Methods for High-Frequency Integrated Passive Components and Amplifiers""; ""Introduction""; ""Review of Related Works and Challenges""; ""RF Integrated Circuit Synthesis ""; ""Basic Computational Intelligence Techniques""; ""Differential Evolution""; ""Gaussian Process Machine Learning"" ""Naive Bayes Classifier""""MMLDE: Efficient Synthesis of Integrated Passive Components at High Frequencies""; ""Key Ideas of MMLDE""; ""Expected Improvement Prescreening""; ""The General Framework of MMLDE""; ""Experimental Results of MMLDE""; ""EMLDE: Efficient Synthesis of mm-Wave Linear Amplifiers""; ""Overview of EMLDE""; ""Key Algorithms in the EMLDE Method""; ""The Embedded SBDE Algorithm""; ""The EMLDE Method""; ""Experimental Verification of the EMLDE Method""; ""Example and Settings""; ""Example: Three-Stage Linear Amplifier Synthesis""; ""Conclusion""; ""References"" ""Self-Healing Circuits Using Statistical Element Selection""""Introduction""; ""Process Variations""; ""Systematic Variations""; ""Random Variations""; ""Mismatch Correction Methods""; ""Statistical Element Selection""; ""Basis""; ""Methodology ""; ""Comparator Array in 65nm Bulk CMOS Technology""; ""Design Architecture""; ""Testing Setup""; ""Measurement Results ""; ""An 8-bit 1.5-GHz Flash ADC in 65nm CMOS Process""; ""Flash ADC Architecture""; ""Comparator Design""; ""Measurement Results ""; ""Conclusion""; ""References"" ""Improving Design Feature Reuse in Analog Circuit Design through Topological-Symbolic Comparison and Design Concept Combination""""Introduction""; ""Related Work""; ""Circuit Synthesis Based on Concept Comparison and Combination""; ""Systematic Comparison of Analog Circuits""; ""Topological Matching""; ""Symbolic Matching""; ""Constraint Generation""; ""Performance Characterization ""; ""Experiments""; ""Conclusion""; ""References ""; ""Graph-Based Symbolic and Symbolic Sensitivity Analysis of Analog Integrated Circuits""; ""Introduction""; ""Nullor Circuit Equivalents"" ""Graph-Based Determinant Representation"" |
Record Nr. | UNINA-9910437911603321 |
Berlin ; ; New York, : Springer, c2013 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Cognitive radio receiver front-ends : RF/analog circuit techniques / / Bodhisatwa Sadhu, Ramesh Harjani |
Autore | Sadhu Bodhisatwa |
Edizione | [1st ed. 2014.] |
Pubbl/distr/stampa | New York : , : Springer, , 2014 |
Descrizione fisica | 1 online resource (vi, 79 pages) : illustrations (chiefly color) |
Disciplina | 621.381 |
Collana | Analog Circuits and Signal Processing |
Soggetto topico |
Radio frequency integrated circuits - Design and construction
Cognitive radio networks |
ISBN | 1-4614-9296-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Introduction -- Cognitive Radio Architectures -- Wideband Voltage Controlled Oscillator -- RF Sampling and Signal Processing -- CRAFT: Charge Re-use Analog Fourier Transform -- Conclusions. |
Record Nr. | UNINA-9910299495903321 |
Sadhu Bodhisatwa | ||
New York : , : Springer, , 2014 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
The design of CMOS radio-frequency integrated circuits / Thomas H. Lee |
Autore | Lee, Thomas H., 1959- |
Edizione | [2nd ed.] |
Pubbl/distr/stampa | Cambridge, UK ; New York : Cambridge University Press, 2004 |
Descrizione fisica | xviii, 797 p. : ill. ; 26 cm |
Disciplina | 621.39732 |
Soggetto topico |
Metal oxide semiconductors, Complementary - Design and construction
Radio frequency integrated circuits - Design and construction Radio - Transmitter-receivers |
ISBN | 0521835399 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNISALENTO-991003929129707536 |
Lee, Thomas H., 1959- | ||
Cambridge, UK ; New York : Cambridge University Press, 2004 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. del Salento | ||
|
ESD [[electronic resource] ] : RF technology and circuits / / Steven H. Voldman |
Autore | Voldman Steven H |
Pubbl/distr/stampa | Chichester, West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2006 |
Descrizione fisica | 1 online resource (422 p.) |
Disciplina |
621.384
621.38412 |
Soggetto topico |
Radio frequency integrated circuits - Design and construction
Radio frequency integrated circuits - Protection Electrostatics Electric discharges - Prevention Static eliminators |
ISBN |
1-280-72219-3
9786610722198 0-470-06140-5 0-470-06139-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
ESD; Contents; Preface; Acknowledgements; Chapter 1 RF DESIGN and ESD; 1.1 Fundamental Concepts of ESD Design; 1.2 Fundamental Concepts of RF ESD Design; 1.3 Key RF ESD Contributions; 1.4 Key RF ESD Patents; 1.5 ESD Failure Mechanisms; 1.5.1 RF CMOS ESD Failure Mechanisms; 1.5.2 Silicon Germanium ESD Failure Mechanisms; 1.5.3 Silicon Germanium Carbon ESD Failure Mechanisms in Silicon Germanium Carbon Devices; 1.5.4 Gallium Arsenide Technology ESD Failure Mechanisms; 1.5.5 Indium Gallium Arsenide ESD Failure Mechanisms; 1.5.6 RF Bipolar Circuits ESD Failure Mechanisms; 1.6 RF Basics
1.7 Two-Port Network Parameters1.7.1 Z-Parameters; 1.7.2 Y-Parameters; 1.7.3. S-Parameters; 1.7.4 T-Parameters; 1.8 Stability: RF Design Stability and ESD; 1.9 Device Degradation and ESD Failure; 1.9.1 ESD-Induced D.C. Parameter Shift and Failure Criteria; 1.9.2 RF Parameters, ESD Degradation, and Failure Criteria; 1.10 RF ESD Testing; 1.10.1 ESD Testing Models; 1.10.2 RF Maximum Power-to-Failure and ESD Pulse Testing Methodology; 1.10.3 ESD-Induced RF Degradation and S-Parameter Evaluation Test Methodology; 1.11 Time Domain Reflectometry (TDR) and Impedance Methodology for ESD Testing 1.11.1 Time Domain Reflectometry (TDR) ESD Test System Evaluation1.11.2 ESD Degradation System Level Method - Eye Tests; 1.12 Product Level ESD Test and RF Functional Parameter Failure; 1.13 Combined RF and ESD TLP Test Systems; 1.14 Closing Comments and Summary; Problems; References; Chapter 2 RF ESD Design; 2.1 ESD Design Methods: Ideal ESD Networks and RF ESD Design Windows; 2.1.1 Ideal ESD Networks and the Current-Voltage d.c. Design Window; 2.1.2 Ideal ESD Networks in the Frequency Domain Design Window; 2.2 RF ESD Design Methods: Linearity 2.3 RF ESD Design: Passive Element Quality Factors and Figures of Merit2.4 RF ESD Design Methods: Method of Substitution; 2.4.1 Method of Substitution of Passive Element to ESD Network Element; 2.4.2 Substitution of ESD Network Element to Passive Element; 2.5 RF ESD Design Methods: Matching Networks and RF ESD Networks; 2.5.1 RF ESD Method - Conversion of Matching Networks to ESD Networks; 2.5.2 RF ESD Method: Conversion of ESD Networks into Matching Networks; 2.5.2.1 Conversion of ESD Networks into L-Match Networks; 2.5.2.2 Conversion of ESD Networks into Pie-Match Networks 2.5.2.3 Conversion of ESD Networks into T-Match Networks2.6 RF ESD Design Methods: Inductive Shunt; 2.7 RF ESD Design Methods: Cancellation Method; 2.7.1 Quality Factors and the Cancellation Method; 2.7.2 Inductive Cancellation of Capacitance Load and Figures of Merit; 2.7.3 Cancellation Method and ESD Circuitry; 2.8 RF ESD Design Methods: Impedance Isolation Technique Using LC Resonator; 2.9 RF ESD Design Methods: Lumped versus Distributed Loads; 2.9.1 RF ESD Distributed Load with Coplanar Wave Guides; 2.9.2 RF ESD Distribution Coplanar Waveguides Analysis Using ABCD Matrices 2.10 ESD RF Design Synthesis and Floor Planning: RF, Analog, and Digital Integration |
Record Nr. | UNINA-9910830973303321 |
Voldman Steven H | ||
Chichester, West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
ESD : RF technology and circuits / / Steven H. Voldman |
Autore | Voldman Steven H |
Pubbl/distr/stampa | Chichester, West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2006 |
Descrizione fisica | 1 online resource (422 p.) |
Disciplina | 621.384/12 |
Soggetto topico |
Radio frequency integrated circuits - Design and construction
Radio frequency integrated circuits - Protection Electrostatics Electric discharges - Prevention Static eliminators |
ISBN |
1-280-72219-3
9786610722198 0-470-06140-5 0-470-06139-1 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
ESD; Contents; Preface; Acknowledgements; Chapter 1 RF DESIGN and ESD; 1.1 Fundamental Concepts of ESD Design; 1.2 Fundamental Concepts of RF ESD Design; 1.3 Key RF ESD Contributions; 1.4 Key RF ESD Patents; 1.5 ESD Failure Mechanisms; 1.5.1 RF CMOS ESD Failure Mechanisms; 1.5.2 Silicon Germanium ESD Failure Mechanisms; 1.5.3 Silicon Germanium Carbon ESD Failure Mechanisms in Silicon Germanium Carbon Devices; 1.5.4 Gallium Arsenide Technology ESD Failure Mechanisms; 1.5.5 Indium Gallium Arsenide ESD Failure Mechanisms; 1.5.6 RF Bipolar Circuits ESD Failure Mechanisms; 1.6 RF Basics
1.7 Two-Port Network Parameters1.7.1 Z-Parameters; 1.7.2 Y-Parameters; 1.7.3. S-Parameters; 1.7.4 T-Parameters; 1.8 Stability: RF Design Stability and ESD; 1.9 Device Degradation and ESD Failure; 1.9.1 ESD-Induced D.C. Parameter Shift and Failure Criteria; 1.9.2 RF Parameters, ESD Degradation, and Failure Criteria; 1.10 RF ESD Testing; 1.10.1 ESD Testing Models; 1.10.2 RF Maximum Power-to-Failure and ESD Pulse Testing Methodology; 1.10.3 ESD-Induced RF Degradation and S-Parameter Evaluation Test Methodology; 1.11 Time Domain Reflectometry (TDR) and Impedance Methodology for ESD Testing 1.11.1 Time Domain Reflectometry (TDR) ESD Test System Evaluation1.11.2 ESD Degradation System Level Method - Eye Tests; 1.12 Product Level ESD Test and RF Functional Parameter Failure; 1.13 Combined RF and ESD TLP Test Systems; 1.14 Closing Comments and Summary; Problems; References; Chapter 2 RF ESD Design; 2.1 ESD Design Methods: Ideal ESD Networks and RF ESD Design Windows; 2.1.1 Ideal ESD Networks and the Current-Voltage d.c. Design Window; 2.1.2 Ideal ESD Networks in the Frequency Domain Design Window; 2.2 RF ESD Design Methods: Linearity 2.3 RF ESD Design: Passive Element Quality Factors and Figures of Merit2.4 RF ESD Design Methods: Method of Substitution; 2.4.1 Method of Substitution of Passive Element to ESD Network Element; 2.4.2 Substitution of ESD Network Element to Passive Element; 2.5 RF ESD Design Methods: Matching Networks and RF ESD Networks; 2.5.1 RF ESD Method - Conversion of Matching Networks to ESD Networks; 2.5.2 RF ESD Method: Conversion of ESD Networks into Matching Networks; 2.5.2.1 Conversion of ESD Networks into L-Match Networks; 2.5.2.2 Conversion of ESD Networks into Pie-Match Networks 2.5.2.3 Conversion of ESD Networks into T-Match Networks2.6 RF ESD Design Methods: Inductive Shunt; 2.7 RF ESD Design Methods: Cancellation Method; 2.7.1 Quality Factors and the Cancellation Method; 2.7.2 Inductive Cancellation of Capacitance Load and Figures of Merit; 2.7.3 Cancellation Method and ESD Circuitry; 2.8 RF ESD Design Methods: Impedance Isolation Technique Using LC Resonator; 2.9 RF ESD Design Methods: Lumped versus Distributed Loads; 2.9.1 RF ESD Distributed Load with Coplanar Wave Guides; 2.9.2 RF ESD Distribution Coplanar Waveguides Analysis Using ABCD Matrices 2.10 ESD RF Design Synthesis and Floor Planning: RF, Analog, and Digital Integration |
Altri titoli varianti | Electrostatic discharge |
Record Nr. | UNINA-9910877635203321 |
Voldman Steven H | ||
Chichester, West Sussex, England ; ; Hoboken, NJ, : J. Wiley, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
High data rate transmitter circuits : RF CMOS design and techniques for design automation / / by Carl De Ranter and Michiel Steyaert |
Autore | De Ranter Carl |
Edizione | [1st ed.] |
Pubbl/distr/stampa | Boston, : Kluwer Academic Publishers, c2003 |
Descrizione fisica | 1 online resource (XVIII, 227 p.) |
Disciplina | 621.384/131 |
Altri autori (Persone) | SteyaertMichiel <1959-> |
Collana | Kluwer international series in engineering and computer science. Analog circuits and signal processing |
Soggetto topico |
Radio - Transmitters and transmission
Radio frequency integrated circuits - Design and construction Metal oxide semiconductors, Complementary Data transmission systems |
ISBN | 0-306-48713-6 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | List of Figures -- List of Tables -- 1: Introduction. 1.1. Some Observations. 1.2. To CMOS or Not to CMOS. 1.3. Covered Topics -- 2: RF Modeling, Quadrature Generation and Flip-Chip Bonding. 2.1. Introduction. 2.2. Influence of Substrate Resistivity on RF-designs. 2.3. RF-Modeling. 2.4.Quadrature LO Generation. 2.5. Manufacturing. 2.6. Conclusions and Use of Presented Topics -- 3: Automated VCO Synthesis. 3.1. Introduction. 3.2. Structured Analog Design Methodology. 3.3. Automation in Functional-Block Design. 3.4. The CYCLONE Tool. 3.5. Final Conclusion -- 4: Voltage-Controlled Oscillators for High Data Rate Applications. 4.1. Oscillators for Broadband Systems. 4.2. Oscillators for RF Frequencies. 4.3. Conclusions -- 5: Design of an Upconverter for High-Speed Data Transmission. 5.1. Introduction: Market Perspective. 5.2. High-Speed Data Link Systems. 5.3. High-Level Design Considerations. 5.4. CMOS Implementation of a High-Bandwidth Upconvertor. 5.5. Final Conclusion -- 6: Conclusions. 6.1. Realized Work. 6.2. Possibilities for Future Research. References. |
Record Nr. | UNINA-9910814317303321 |
De Ranter Carl | ||
Boston, : Kluwer Academic Publishers, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Integration of passive RF front end components in SoCs / / Hooman Darabi, Broadcom Corporation, Ahmad Mirzaei, Broadcom Corporation [[electronic resource]] |
Autore | Darabi Hooman <1972-> |
Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2013 |
Descrizione fisica | 1 online resource (xii, 190 pages) : digital, PDF file(s) |
Disciplina | 621.3841/33 |
Soggetto topico |
Electric filters, Bandpass
Radio frequency integrated circuits - Design and construction |
ISBN |
1-139-62439-3
1-107-23250-3 1-139-03072-8 1-139-60951-3 1-139-60822-3 1-139-61137-2 1-139-61509-2 1-299-40567-3 1-139-62067-3 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Machine generated contents note: Part I. Introduction to Highly Integrated and Tunable RF Receiver Front Ends: 1. Introduction; 2. Front-end integration challenges and system requirements; 3. 2G receiver SAW elimination; 4. 3G receiver SAW elimination; 5. Summary and conclusions; Part II. Active Blocker Cancellation Techniques in Receivers: 6. Introduction; 7. Concept of receiver translational loop; 8. Non-ideal effects; 9. Circuit implementations; 10. Measurement results; 11. Feedback blocker cancellation techniques; 12. Summary and conclusions; Part III. Impedance Transformation: Introduction to the Simplest On-Chip SAW Filter: 13. Introduction; 14. Impedance transformation by a 50% passive mixer; 15. Application as on-chip SAW filter; 16. Impact of harmonics on the sharpness of the proposed filter; 17. Differential implementation; 18. Summary and conclusions; Part IV. Four-Phase High-Q Bandpass Filters: 19. Introduction; 20. Impedance transformation by a four-phase filter; 21. Differential implementation of four-phase high-Q bandpass filter; 22. Application as an on-chip SAW filter; 23. Impact of harmonics on the sharpness of the proposed filter; 24. Four-phase high-Q bandpass filter with a complex baseband impedance; 25. Four-phase high-Q bandpass filter with quadrature RF inputs; 26. Harmonic upconversion and downconversion; 27. A SAW-less receiver with on-chip four-phase high-Q bandpass filters; 28. Summary and conclusions; Part V. M-Phase High-Q Bandpass Filters: 29. Introduction; 30. Impedance transformation by M-phase filters; 31. Differential implementation of M-phase high-Q filter; 32. Application as an on-chip SAW filter; 33. Impact of harmonics on the sharpness of the M-phase bandpass filter; 34. M-phase high-Q filter with complex baseband impedances; 35. M-phase high-Q bandpass filter with quadrature RF inputs; 36. M-phase high-Q bandpass filter with N-phase complex bandpass filters; 37. Harmonic upconversion; 38. Summary and conclusions; Part VI. Design of a Superheterodyne Receiver Using M-Phase Filters: 39. Introduction; 40. Proposed superheterodyne receiver architecture; 41. Design and implementation of the receiver chain; 42. Measurement results; 43. Summary and conclusions; Part VII. Impact of Imperfections on the Performance of M-Phase Filters: 44. Introduction; 45. Mathematical background; 46. LO phase noise; 47. Second-order nonlinearity in the switches of the bandpass filter; 48. Quadrature error in the original 50% duty-cycle clock phases; 49. Harmonic downconversion; 50. Thermal noise of switches; 51. Parasitic capacitors of switches; 52. Switch charge injection; 53. Mismatches; 54. Summary and conclusions; Part VIII. M-Phase Filtering and Duality: 55. Introduction; 56. Dual of an electrical circuit, dual of a switch; 57. Dual of M-phase filter, differential implementation of M-phase filter and its dual; 58. Dual of M-phase high-Q filter with complex baseband impedances; 59. Summary and conclusions. |
Record Nr. | UNINA-9910452365803321 |
Darabi Hooman <1972-> | ||
Cambridge : , : Cambridge University Press, , 2013 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Integration of passive RF front end components in SoCs / / Hooman Darabi, Broadcom Corporation, Ahmad Mirzaei, Broadcom Corporation [[electronic resource]] |
Autore | Darabi Hooman <1972-> |
Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2013 |
Descrizione fisica | 1 online resource (xii, 190 pages) : digital, PDF file(s) |
Disciplina | 621.3841/33 |
Soggetto topico |
Electric filters, Bandpass
Radio frequency integrated circuits - Design and construction |
ISBN |
1-139-62439-3
1-107-23250-3 1-139-03072-8 1-139-60951-3 1-139-60822-3 1-139-61137-2 1-139-61509-2 1-299-40567-3 1-139-62067-3 |
Classificazione | TEC008010 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Machine generated contents note: Part I. Introduction to Highly Integrated and Tunable RF Receiver Front Ends: 1. Introduction; 2. Front-end integration challenges and system requirements; 3. 2G receiver SAW elimination; 4. 3G receiver SAW elimination; 5. Summary and conclusions; Part II. Active Blocker Cancellation Techniques in Receivers: 6. Introduction; 7. Concept of receiver translational loop; 8. Non-ideal effects; 9. Circuit implementations; 10. Measurement results; 11. Feedback blocker cancellation techniques; 12. Summary and conclusions; Part III. Impedance Transformation: Introduction to the Simplest On-Chip SAW Filter: 13. Introduction; 14. Impedance transformation by a 50% passive mixer; 15. Application as on-chip SAW filter; 16. Impact of harmonics on the sharpness of the proposed filter; 17. Differential implementation; 18. Summary and conclusions; Part IV. Four-Phase High-Q Bandpass Filters: 19. Introduction; 20. Impedance transformation by a four-phase filter; 21. Differential implementation of four-phase high-Q bandpass filter; 22. Application as an on-chip SAW filter; 23. Impact of harmonics on the sharpness of the proposed filter; 24. Four-phase high-Q bandpass filter with a complex baseband impedance; 25. Four-phase high-Q bandpass filter with quadrature RF inputs; 26. Harmonic upconversion and downconversion; 27. A SAW-less receiver with on-chip four-phase high-Q bandpass filters; 28. Summary and conclusions; Part V. M-Phase High-Q Bandpass Filters: 29. Introduction; 30. Impedance transformation by M-phase filters; 31. Differential implementation of M-phase high-Q filter; 32. Application as an on-chip SAW filter; 33. Impact of harmonics on the sharpness of the M-phase bandpass filter; 34. M-phase high-Q filter with complex baseband impedances; 35. M-phase high-Q bandpass filter with quadrature RF inputs; 36. M-phase high-Q bandpass filter with N-phase complex bandpass filters; 37. Harmonic upconversion; 38. Summary and conclusions; Part VI. Design of a Superheterodyne Receiver Using M-Phase Filters: 39. Introduction; 40. Proposed superheterodyne receiver architecture; 41. Design and implementation of the receiver chain; 42. Measurement results; 43. Summary and conclusions; Part VII. Impact of Imperfections on the Performance of M-Phase Filters: 44. Introduction; 45. Mathematical background; 46. LO phase noise; 47. Second-order nonlinearity in the switches of the bandpass filter; 48. Quadrature error in the original 50% duty-cycle clock phases; 49. Harmonic downconversion; 50. Thermal noise of switches; 51. Parasitic capacitors of switches; 52. Switch charge injection; 53. Mismatches; 54. Summary and conclusions; Part VIII. M-Phase Filtering and Duality: 55. Introduction; 56. Dual of an electrical circuit, dual of a switch; 57. Dual of M-phase filter, differential implementation of M-phase filter and its dual; 58. Dual of M-phase high-Q filter with complex baseband impedances; 59. Summary and conclusions. |
Record Nr. | UNINA-9910779410003321 |
Darabi Hooman <1972-> | ||
Cambridge : , : Cambridge University Press, , 2013 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Integration of passive RF front end components in SoCs / / Hooman Darabi, Broadcom Corporation, Ahmad Mirzaei, Broadcom Corporation [[electronic resource]] |
Autore | Darabi Hooman <1972-> |
Pubbl/distr/stampa | Cambridge : , : Cambridge University Press, , 2013 |
Descrizione fisica | 1 online resource (xii, 190 pages) : digital, PDF file(s) |
Disciplina | 621.3841/33 |
Soggetto topico |
Electric filters, Bandpass
Radio frequency integrated circuits - Design and construction |
ISBN |
1-139-62439-3
1-107-23250-3 1-139-03072-8 1-139-60951-3 1-139-60822-3 1-139-61137-2 1-139-61509-2 1-299-40567-3 1-139-62067-3 |
Classificazione | TEC008010 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Machine generated contents note: Part I. Introduction to Highly Integrated and Tunable RF Receiver Front Ends: 1. Introduction; 2. Front-end integration challenges and system requirements; 3. 2G receiver SAW elimination; 4. 3G receiver SAW elimination; 5. Summary and conclusions; Part II. Active Blocker Cancellation Techniques in Receivers: 6. Introduction; 7. Concept of receiver translational loop; 8. Non-ideal effects; 9. Circuit implementations; 10. Measurement results; 11. Feedback blocker cancellation techniques; 12. Summary and conclusions; Part III. Impedance Transformation: Introduction to the Simplest On-Chip SAW Filter: 13. Introduction; 14. Impedance transformation by a 50% passive mixer; 15. Application as on-chip SAW filter; 16. Impact of harmonics on the sharpness of the proposed filter; 17. Differential implementation; 18. Summary and conclusions; Part IV. Four-Phase High-Q Bandpass Filters: 19. Introduction; 20. Impedance transformation by a four-phase filter; 21. Differential implementation of four-phase high-Q bandpass filter; 22. Application as an on-chip SAW filter; 23. Impact of harmonics on the sharpness of the proposed filter; 24. Four-phase high-Q bandpass filter with a complex baseband impedance; 25. Four-phase high-Q bandpass filter with quadrature RF inputs; 26. Harmonic upconversion and downconversion; 27. A SAW-less receiver with on-chip four-phase high-Q bandpass filters; 28. Summary and conclusions; Part V. M-Phase High-Q Bandpass Filters: 29. Introduction; 30. Impedance transformation by M-phase filters; 31. Differential implementation of M-phase high-Q filter; 32. Application as an on-chip SAW filter; 33. Impact of harmonics on the sharpness of the M-phase bandpass filter; 34. M-phase high-Q filter with complex baseband impedances; 35. M-phase high-Q bandpass filter with quadrature RF inputs; 36. M-phase high-Q bandpass filter with N-phase complex bandpass filters; 37. Harmonic upconversion; 38. Summary and conclusions; Part VI. Design of a Superheterodyne Receiver Using M-Phase Filters: 39. Introduction; 40. Proposed superheterodyne receiver architecture; 41. Design and implementation of the receiver chain; 42. Measurement results; 43. Summary and conclusions; Part VII. Impact of Imperfections on the Performance of M-Phase Filters: 44. Introduction; 45. Mathematical background; 46. LO phase noise; 47. Second-order nonlinearity in the switches of the bandpass filter; 48. Quadrature error in the original 50% duty-cycle clock phases; 49. Harmonic downconversion; 50. Thermal noise of switches; 51. Parasitic capacitors of switches; 52. Switch charge injection; 53. Mismatches; 54. Summary and conclusions; Part VIII. M-Phase Filtering and Duality: 55. Introduction; 56. Dual of an electrical circuit, dual of a switch; 57. Dual of M-phase filter, differential implementation of M-phase filter and its dual; 58. Dual of M-phase high-Q filter with complex baseband impedances; 59. Summary and conclusions. |
Record Nr. | UNINA-9910813432803321 |
Darabi Hooman <1972-> | ||
Cambridge : , : Cambridge University Press, , 2013 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Multilayer integrated film bulk acoustic resonators / / Yafei Zhang, Da Chen |
Autore | Zhang Yafei |
Edizione | [1st ed. 2013.] |
Pubbl/distr/stampa | Berlin ; ; New York, : Springer |
Descrizione fisica | 1 online resource (158 p.) |
Disciplina | 612 |
Altri autori (Persone) | ChenDa |
Soggetto topico |
Radio resonators - Design and construction
Radio frequency integrated circuits - Design and construction Thin films, Multilayered |
ISBN |
1-283-63155-5
9786613944009 3-642-31776-6 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Introduction -- Propagation of Acoustic Wave in Crystals -- The Theory of FBAR -- The Sputtering Deposition and Etching of AlN Film -- The Membrane Structured FBAR -- Solidly Mounted Acoustic Resonator -- The Application of FBAR in RF Filters -- The FBAR Excited by Lateral Filed -- High Sensitive Sensors Based on FBAR. |
Record Nr. | UNINA-9910437881603321 |
Zhang Yafei | ||
Berlin ; ; New York, : Springer | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|