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2006 2nd IET Seminar on Micro/Nanotechnology in Medicine : 4-4 May 2006
2006 2nd IET Seminar on Micro/Nanotechnology in Medicine : 4-4 May 2006
Pubbl/distr/stampa Stevenage, England : , : IET, , 2007
Descrizione fisica 1 online resource (115 pages)
Soggetto topico Nanotechnology
Biotechnology
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996216755403316
Stevenage, England : , : IET, , 2007
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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2006 bio-, micro-, and nanosystems conference : San Francisco, CA, 15-18 January 2006
2006 bio-, micro-, and nanosystems conference : San Francisco, CA, 15-18 January 2006
Pubbl/distr/stampa IEEE
Disciplina 660.6
Soggetto topico Biotechnology
Microelectromechanical systems
Nanotechnology
ISBN 1-5090-9357-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2006 Bio Micro and Nanosystems Conference
Group IV Photonics
Record Nr. UNISA-996278338903316
IEEE
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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2006 bio-, micro-, and nanosystems conference : San Francisco, CA, 15-18 January 2006
2006 bio-, micro-, and nanosystems conference : San Francisco, CA, 15-18 January 2006
Pubbl/distr/stampa IEEE
Disciplina 660.6
Soggetto topico Biotechnology
Microelectromechanical systems
Nanotechnology
ISBN 1-5090-9357-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 2006 Bio Micro and Nanosystems Conference
Group IV Photonics
Record Nr. UNINA-9910142717703321
IEEE
Materiale a stampa
Lo trovi qui: Univ. Federico II
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2018 1st International Conference on Bioinformatics, Biotechnology, and Biomedical Engineering-Bioinformatics and Biomedical Engineering : 19-20 October 2018, Yogyakarta, Indonesia / / Institute of Electrical and Electronics Engineers. Indonesia Section
2018 1st International Conference on Bioinformatics, Biotechnology, and Biomedical Engineering-Bioinformatics and Biomedical Engineering : 19-20 October 2018, Yogyakarta, Indonesia / / Institute of Electrical and Electronics Engineers. Indonesia Section
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (39 pages)
Disciplina 572.80285
Soggetto topico Bioinformatics
Biotechnology
Biomedical engineering
ISBN 1-5386-7599-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910305944603321
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. Federico II
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2018 1st International Conference on Bioinformatics, Biotechnology, and Biomedical Engineering-Bioinformatics and Biomedical Engineering : 19-20 October 2018, Yogyakarta, Indonesia / / Institute of Electrical and Electronics Engineers. Indonesia Section
2018 1st International Conference on Bioinformatics, Biotechnology, and Biomedical Engineering-Bioinformatics and Biomedical Engineering : 19-20 October 2018, Yogyakarta, Indonesia / / Institute of Electrical and Electronics Engineers. Indonesia Section
Pubbl/distr/stampa Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Descrizione fisica 1 online resource (39 pages)
Disciplina 572.80285
Soggetto topico Bioinformatics
Biotechnology
Biomedical engineering
ISBN 1-5386-7599-4
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNISA-996575300903316
Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2018
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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27th Symposium on Biotechnology for Fuels and Chemicals [[electronic resource] ] : hosted by the National Renewable Energy Laboratory : program and abstracts : Denver Marriott City Center Hotel, Denver, Colorado, May 1-4, 2005 / / sponsors, Office of the Biomass Program, U.S. Department of Energy ... [and others] ; prepared by National Renewable Energy Laboratory
27th Symposium on Biotechnology for Fuels and Chemicals [[electronic resource] ] : hosted by the National Renewable Energy Laboratory : program and abstracts : Denver Marriott City Center Hotel, Denver, Colorado, May 1-4, 2005 / / sponsors, Office of the Biomass Program, U.S. Department of Energy ... [and others] ; prepared by National Renewable Energy Laboratory
Pubbl/distr/stampa Golden, CO : , : National Renewable Energy Laboratory, , [2005?]
Descrizione fisica 1 volume : digital, PDF file
Soggetto topico Biomass energy
Biotechnology
Biomass chemicals
Soggetto genere / forma Conference papers and proceedings.
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti 27th Symposium on Biotechnology for Fuels and Chemicals
Record Nr. UNINA-9910694637403321
Golden, CO : , : National Renewable Energy Laboratory, , [2005?]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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3 Biotech
3 Biotech
Pubbl/distr/stampa [Berlin], : Springer, 2011-
Descrizione fisica 1 online resource
Soggetto topico Biotechnology industries
Biotechnology
Biotecnologia
Indústries biotecnològiques
Soggetto genere / forma Periodical
Fulltext
Internet Resources.
Periodicals.
Revistes electròniques.
Soggetto non controllato Industries
ISSN 2190-5738
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti Three biotech
3biotech (Berlin)
Record Nr. UNISA-996208597003316
[Berlin], : Springer, 2011-
Materiale a stampa
Lo trovi qui: Univ. di Salerno
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3 Biotech
3 Biotech
Pubbl/distr/stampa [Berlin], : Springer, 2011-
Descrizione fisica 1 online resource
Soggetto topico Biotechnology industries
Biotechnology
Biotecnologia
Indústries biotecnològiques
Soggetto genere / forma Periodical
Fulltext
Internet Resources.
Periodicals.
Revistes electròniques.
Soggetto non controllato Industries
ISSN 2190-5738
Formato Materiale a stampa
Livello bibliografico Periodico
Lingua di pubblicazione eng
Altri titoli varianti Three biotech
3biotech (Berlin)
Record Nr. UNINA-9910133469103321
[Berlin], : Springer, 2011-
Materiale a stampa
Lo trovi qui: Univ. Federico II
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3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal
3D microelectronic packaging : from architectures to applications / / editors, Yan Li, Deepak Goyal
Edizione [2nd edition 2021.]
Pubbl/distr/stampa Singapore : , : Springer, , [2021]
Descrizione fisica 1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.)
Disciplina 929.374
Collana Springer Series in Advanced Microelectronics
Soggetto topico Biotechnology
Electronics
Electronics - Materials
Microelectronics
Microelectronics - Packaging
Nanotechnology
Electronic circuits
Optical materials
ISBN 981-15-7090-6
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto 1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging.
Record Nr. UNINA-9910484726403321
Singapore : , : Springer, , [2021]
Materiale a stampa
Lo trovi qui: Univ. Federico II
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3D Microelectronic Packaging [[electronic resource] ] : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
3D Microelectronic Packaging [[electronic resource] ] : From Fundamentals to Applications / / edited by Yan Li, Deepak Goyal
Edizione [1st ed. 2017.]
Pubbl/distr/stampa Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017
Descrizione fisica 1 online resource (IX, 463 p. 331 illus., 253 illus. in color.)
Disciplina 621.381
Collana Springer Series in Advanced Microelectronics
Soggetto topico Electronics
Microelectronics
Optical materials
Electronic materials
Electronic circuits
Biotechnology
Nanotechnology
Metals
Electronics and Microelectronics, Instrumentation
Optical and Electronic Materials
Electronic Circuits and Devices
Microengineering
Nanotechnology and Microengineering
Metallic Materials
ISBN 3-319-44586-3
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. .
Record Nr. UNINA-9910163046303321
Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017
Materiale a stampa
Lo trovi qui: Univ. Federico II
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