11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
Descrizione fisica | 1 online resource (119 p.) |
Disciplina | 621.367 |
Collana | Advanced Materials Research |
Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
Soggetto genere / forma | Electronic books. |
ISBN | 3-03826-636-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
Record Nr. | UNINA-9910460003603321 |
Pfaffikon, Switzerland : , : TTP, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
Descrizione fisica | 1 online resource (119 p.) |
Disciplina | 621.367 |
Collana | Advanced Materials Research |
Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
ISBN | 3-03826-636-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
Record Nr. | UNINA-9910787022703321 |
Pfaffikon, Switzerland : , : TTP, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
Descrizione fisica | 1 online resource (119 p.) |
Disciplina | 621.367 |
Collana | Advanced Materials Research |
Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
ISBN | 3-03826-636-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
Record Nr. | UNINA-9910811577503321 |
Pfaffikon, Switzerland : , : TTP, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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E home-symposium-multidisciplinary smart home symposium on energy efficient, self-determined and intelligent living : selected, peer reviewed papers from the 1st E home-symposium, November 30-December 1, 2016, Nuremberg, Germany / / edited by Jorg Franke and Markus Michl |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : Trans Tech Publications, , 2016 |
Descrizione fisica | 1 online resource (172 pages) : illustrations |
Disciplina | 696 |
Collana | Advanced Engineering Forum |
Soggetto topico |
Dwellings - Energy conservation
Ecological houses - Design and construction Dwellings - Heating and ventilation |
ISBN | 3-0357-3071-7 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910136239503321 |
Pfaffikon, Switzerland : , : Trans Tech Publications, , 2016 | ||
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Lo trovi qui: Univ. Federico II | ||
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Energy efficiency in strategy of sustainable production . Volume 2 Selected, Peer Rviewed Papers from the 3rd Green Factory Bavaria Colloquium, 2016, November 30-December 1, 2016, Convention Center Nuremberg, Germany / / edited by Jorg Franke and Sven Kreitlein |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : Trans Tech Publications, , 2017 |
Descrizione fisica | 1 online resource (260 pages) : illustrations |
Disciplina | 670 |
Collana | Applied Mechanics and Materials |
Soggetto topico |
Manufacturing processes - Technological innovations
Production engineering - Technological innovations |
ISBN | 3-0357-3057-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Record Nr. | UNINA-9910155268203321 |
Pfaffikon, Switzerland : , : Trans Tech Publications, , 2017 | ||
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Lo trovi qui: Univ. Federico II | ||
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Green factory Bavaria colloquium 2014 : selected, peer reviewed papers from the 1st Green Factory Colloquium, September 30-October 1, 2014, Nuremberg, Germany / / edited by Jörg Franke and Sven Kreitlein |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 |
Descrizione fisica | 1 online resource (103 p.) |
Disciplina | 658.408 |
Collana | Applied Mechanics and Materials |
Soggetto topico |
Production management - Environmental aspects
Manufacturing processes - Environmental aspects |
Soggetto genere / forma | Electronic books. |
ISBN | 3-03826-667-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Green Factory Bavaria Colloquium 2014; Preface; Table of Contents; Chapter 1: Sustainable Manufacturing Strategies; Life Cycle Assessment Tool in the Early Stage of Development; Contribution for the Life Cycle Oriented Evaluation of Costs and Resource Efficiency of Production Machines in Procurement; E|Benchmark - Approaches and Methods for Assessing the Energy Efficiency of the Industrial Automated Product Manufacturing; Identification of Energy Consumption and Energy Saving Potentials of Electric Drive Systems; Energy Concepts for Manufacturing Companies; Chapter 2: Energy Measuring Systems
Energy Controlling - Analysis and Evaluation of Energy Measuring Equipment for the Purpose of Energy Transparency in Production Plants Development of an Adjustable Measuring System for Electrical Consumptions in Production; Identifying Energy Efficiency Potentials by Applying Flexible Measuring Systems; Energy Planning of Manufacturing Systems with Methods-Energy Measurement (MEM) and Multi-Domain Simulation Approach; Estimating Machine Power Consumptions through Aggregated Measurements and Machine Data Acquisition; Chapter 3: Energy Efficient Process Technologies Methodology to Increase Energy Efficiency in Discrete Manufacturing Energy Efficient Manufacturing of Lightweight Products Illustrated by a Structural Optimization of an Automatic Knife Cutting System; Basic Investigation on Melting Operations in the Die Casting Industry to Increase Manufacturing Efficiency and Process Reliability; Influence of Temperature and Wavelength on Optical Behavior of Copper Alloys; Energy Efficiency Investigation on High-Pressure Convection Reflow Soldering in Electronics Production; Keywords Index; Authors Index |
Record Nr. | UNINA-9910460065603321 |
Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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Green factory Bavaria colloquium 2014 : selected, peer reviewed papers from the 1st Green Factory Colloquium, September 30-October 1, 2014, Nuremberg, Germany / / edited by Jörg Franke and Sven Kreitlein |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 |
Descrizione fisica | 1 online resource (103 p.) |
Disciplina | 658.408 |
Collana | Applied Mechanics and Materials |
Soggetto topico |
Production management - Environmental aspects
Manufacturing processes - Environmental aspects |
ISBN | 3-03826-667-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Green Factory Bavaria Colloquium 2014; Preface; Table of Contents; Chapter 1: Sustainable Manufacturing Strategies; Life Cycle Assessment Tool in the Early Stage of Development; Contribution for the Life Cycle Oriented Evaluation of Costs and Resource Efficiency of Production Machines in Procurement; E|Benchmark - Approaches and Methods for Assessing the Energy Efficiency of the Industrial Automated Product Manufacturing; Identification of Energy Consumption and Energy Saving Potentials of Electric Drive Systems; Energy Concepts for Manufacturing Companies; Chapter 2: Energy Measuring Systems
Energy Controlling - Analysis and Evaluation of Energy Measuring Equipment for the Purpose of Energy Transparency in Production Plants Development of an Adjustable Measuring System for Electrical Consumptions in Production; Identifying Energy Efficiency Potentials by Applying Flexible Measuring Systems; Energy Planning of Manufacturing Systems with Methods-Energy Measurement (MEM) and Multi-Domain Simulation Approach; Estimating Machine Power Consumptions through Aggregated Measurements and Machine Data Acquisition; Chapter 3: Energy Efficient Process Technologies Methodology to Increase Energy Efficiency in Discrete Manufacturing Energy Efficient Manufacturing of Lightweight Products Illustrated by a Structural Optimization of an Automatic Knife Cutting System; Basic Investigation on Melting Operations in the Die Casting Industry to Increase Manufacturing Efficiency and Process Reliability; Influence of Temperature and Wavelength on Optical Behavior of Copper Alloys; Energy Efficiency Investigation on High-Pressure Convection Reflow Soldering in Electronics Production; Keywords Index; Authors Index |
Record Nr. | UNINA-9910787298203321 |
Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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Green factory Bavaria colloquium 2014 : selected, peer reviewed papers from the 1st Green Factory Colloquium, September 30-October 1, 2014, Nuremberg, Germany / / edited by Jörg Franke and Sven Kreitlein |
Pubbl/distr/stampa | Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 |
Descrizione fisica | 1 online resource (103 p.) |
Disciplina | 658.408 |
Collana | Applied Mechanics and Materials |
Soggetto topico |
Production management - Environmental aspects
Manufacturing processes - Environmental aspects |
ISBN | 3-03826-667-1 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Green Factory Bavaria Colloquium 2014; Preface; Table of Contents; Chapter 1: Sustainable Manufacturing Strategies; Life Cycle Assessment Tool in the Early Stage of Development; Contribution for the Life Cycle Oriented Evaluation of Costs and Resource Efficiency of Production Machines in Procurement; E|Benchmark - Approaches and Methods for Assessing the Energy Efficiency of the Industrial Automated Product Manufacturing; Identification of Energy Consumption and Energy Saving Potentials of Electric Drive Systems; Energy Concepts for Manufacturing Companies; Chapter 2: Energy Measuring Systems
Energy Controlling - Analysis and Evaluation of Energy Measuring Equipment for the Purpose of Energy Transparency in Production Plants Development of an Adjustable Measuring System for Electrical Consumptions in Production; Identifying Energy Efficiency Potentials by Applying Flexible Measuring Systems; Energy Planning of Manufacturing Systems with Methods-Energy Measurement (MEM) and Multi-Domain Simulation Approach; Estimating Machine Power Consumptions through Aggregated Measurements and Machine Data Acquisition; Chapter 3: Energy Efficient Process Technologies Methodology to Increase Energy Efficiency in Discrete Manufacturing Energy Efficient Manufacturing of Lightweight Products Illustrated by a Structural Optimization of an Automatic Knife Cutting System; Basic Investigation on Melting Operations in the Die Casting Industry to Increase Manufacturing Efficiency and Process Reliability; Influence of Temperature and Wavelength on Optical Behavior of Copper Alloys; Energy Efficiency Investigation on High-Pressure Convection Reflow Soldering in Electronics Production; Keywords Index; Authors Index |
Record Nr. | UNINA-9910822216403321 |
Pfaffikon, Switzerland : , : Trans Tech Publications Ltd, , 2014 | ||
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Lo trovi qui: Univ. Federico II | ||
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Optical polymer waveguides : from the design to the final 3D-opto mechatronic integrated device / / edited by Jörg Franke, [and six others] |
Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
Descrizione fisica | 1 online resource (283 pages) |
Disciplina | 410.5 |
Soggetto topico | Optical fibers |
ISBN | 3-030-92854-3 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro -- Preface -- Contents -- 1 Current Development in the Field of Optical Short-Range Interconnects -- 1.1 Advantages of Optical Communication -- 1.2 3D-Opto-MID for Optical Bus Systems -- 1.2.1 Short-range optical waveguides networks -- 1.2.2 Optical bus systems -- 1.2.3 Current development in the field of 3D-Opto-MID -- 1.3 New Approach for Additive Manufactured 3D-Opto-MID -- References -- 2 Computer-Aided Design of Electro-Optical Assemblies -- Abstract -- 2.1 Demand on Software-Based Design Tools for Spatial Optoelectronics -- 2.2 State of the Art in the Design of Electro-optical Circuits and MID -- 2.2.1 General Procedures for Electronic and Electro-optical Assemblies -- 2.2.2 Electronics Design Process -- 2.2.3 Procedure for Spatial Electronic Assemblies (3D-MID) -- 2.2.4 Procedure in electro-optical design -- 2.2.5 Evaluation -- 2.3 Need for Action for the Computer-aided Modeling of 3D-Opto-MID -- 2.3.1 General Functional Requirements for a 3D Optomechatronic CAD System -- 2.3.2 General Aspects -- 2.3.2.1 Aspects of Design -- 2.3.2.2 Aspects Resulting from Manufacturing -- 2.3.2.3 Aspects of Software Systems -- 2.3.3 Summary -- 2.4 Concept of a Cross-domain Methodology for Optomechatronic Components -- 2.4.1 Considerations for the Design and Workflow of a Computer-aided 3D-Opto-MID System -- 2.4.2 Integration of Optical Functionalities in a 3D-OMCAD System -- 2.5 Prototypical Integration of Optomechatronic Functions into a 3D-Opto-MID Design System -- 2.5.1 Circuit Carrier and Substrate Modeling -- 2.5.2 Synthesis of Circuits -- 2.5.3 Waveguide Modeling, Routing Optimization and Wiring -- 2.5.3.1 Manual Routing -- 2.5.3.2 Automatic Routing -- 2.5.4 Design Rule Checks -- 2.5.5 Interface to Optical Simulation -- References -- 3 Three-Dimensional Simulations of Optical Multimode Waveguides -- 3.1 Demands on the Simulation.
3.2 Geometric Optical Simulation -- 3.2.1 State of the art for Raytracing -- 3.2.2 Mathematical Properties for the Description of a POW -- 3.2.3 Algorithm for Arbitrary Cross sections -- 3.2.4 Impact of Manufacturing Parameters on the Optical Properties -- 3.3 Physical Optical Simulation -- 3.3.1 State of the art for Wave Propagation Method (WPM) -- 3.3.2 Impact of Periodicity of Discrete Fourier Transform -- 3.3.3 Simulation of Waveguides -- References -- 4 Conditioning of Flexible Substrates for the Application of Optical Waveguides -- 4.1 Wetting Control by Conditioning -- 4.1.1 Wetting and Capillarity -- 4.1.2 Wetting Control by Changing the Chemical Properties -- 4.2 State of the art for Functional Flexographic Printing -- 4.2.1 Applications -- 4.2.2 Flexographic Printing Process -- 4.3 Selection and Design of the Printing Form -- 4.4 Characterization and Selection of the Materials -- 4.4.1 Selection of the Printing Varnish -- 4.4.2 Selection of the Substrate Material -- 4.5 Experimental Studies of the Conditioning Line Printing Process -- 4.5.1 Experimental Setup -- 4.5.2 Automated Evaluation of Geometric Quality -- 4.5.3 Geometry of the Conditioning Lines -- 4.5.4 Formation of Edge Ripples and Topography -- 4.6 Modeling of Stamp Deformation in the Printing Process -- 4.7 Manufacturing Three-Dimensional Optical Interconnects -- 4.7.1 Studies on the Thermoforming of Conditioned Film Substrates -- 4.8 Surface Functionalization for Wetting Behavior Adjustment of Flexographic Printing Forms -- 4.8.1 Functionalization by Laser-Induced Microstructures -- 4.8.2 Functionalization by Coating Mechanisms -- 4.8.3 Functionalization by Chemical Modification -- 4.8.4 Application of Functionalization Mechanisms on Flexographic Printing Forms and its Impact on the Printing Results -- 4.8.5 Impact of the Functionalization on the Printing Results -- References. 5 Aerosol Jet Printing of Polymer Optical Waveguides -- 5.1 State-of-the-Art Fabrication of the Polymer Optical Waveguide -- 5.1.1 Photolithography -- 5.1.2 Photolysis -- 5.1.3 Photolocking -- 5.1.4 Photobleaching -- 5.1.5 Reactive Ion Etching (RIE) -- 5.1.6 Laser Ablation -- 5.1.7 Dispense Printing -- 5.1.8 Mosquito Method -- 5.1.9 Inkjet Printing -- 5.1.10 Aerosol Jet Printing -- 5.2 Polymer Optical Waveguides Fabrication Through Aerosol Jet Printing -- 5.2.1 Principles of Aerosol Jet Printing -- 5.2.2 Selection of Polymer Optical Material for Aerosol Jet Printing Process -- 5.2.3 Effect of the Material Temperature on the Mass Flow Output -- 5.3 Fabrication Process Steps -- 5.3.1 Motion3D: CADCAM Design and NC Code Generation -- 5.3.2 Remote-NC: 5-Axes Kinematic System -- 5.3.3 AJP Process Parameter -- 5.4 Theoretical AJ Printed Polymer Optical Waveguide Geometry -- 5.5 Strategies in Aerosol Jet Printed Polymer Optical Waveguide -- 5.5.1 Single-layer Printing: Immediate UV Curing Process -- 5.5.2 Multi-layer Printing: Immediate UV Curing Process -- 5.5.3 Multi-layer Printing: UV Curing After the Complete Layer Printing -- 5.6 Qualification and Characterization of the Printed Polymer Optical Waveguide -- 5.6.1 Geometrical Properties -- 5.6.2 Profile Dimension -- 5.6.3 Effect of the Surface Roughness and Waviness -- 5.7 Morphology Analysis -- 5.7.1 Overspray -- 5.7.2 Waviness -- 5.7.3 Impurities -- 5.7.4 Bulging -- 5.7.5 Bubble or Air Pocket -- 5.8 Mechanical and Optical Properties of the Printed Polymer Optical Waveguide -- 5.8.1 Hot-Pin-Pull Test -- 5.8.2 Shear Force Test -- 5.8.3 Lifetime Performance Test -- 5.8.4 Optical Quality -- 5.9 Modeling and Simulation Analysis of the Aerosol Jet Printhead -- 5.9.1 Modeling and Operational Principles -- 5.9.2 Simulation Results Analysis -- 5.10 Summary -- References. 6 3D-Opto-MID Coupling Concept Using Printed Waveguides -- 6.1 Coupling Strategies for Large-Scale Optical Networks -- 6.1.1 Demands for Optical Bus Coupling -- 6.1.2 State of the Art for Optical Bus Couplers -- 6.1.3 Theoretical Basis for the Asymmetric Optical Bus Coupler -- 6.2 Simulation of the Asymmetric Optical Bus Coupler -- 6.2.1 Parameters for the Mathematical Model of the Bus Coupler -- 6.2.2 2D Simulation -- 6.2.3 3D Parameter Extension -- 6.2.4 3D Simulation -- 6.3 Performance of the Asymmetric Optical Bus Coupler -- 6.3.1 Measurement Setup -- 6.3.2 Coupling Results -- 6.3.3 Data Transmission via the Asymmetric Optical Bus Coupler -- 6.3.4 Long-Term Stability of the AOBC -- 6.4 Technologies for Three-Dimensional Electro-Optical Interconnects -- 6.4.1 Packaging Demands and State-Of-The-Art for 3D-Opto-MID -- 6.4.2 Polymer-Ceramic Hybrid Assembly for 3D-Opto-MID -- 6.4.3 Long-Term Stability of the 3D-Opto-MID -- References -- 7 Feasibility of Printed Optical Waveguides Over the Entire Process Chain by OPTAVER. |
Record Nr. | UNISA-996503464403316 |
Cham, Switzerland : , : Springer, , [2022] | ||
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Lo trovi qui: Univ. di Salerno | ||
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Optical polymer waveguides : from the design to the final 3D-opto mechatronic integrated device / / edited by Jörg Franke, [and six others] |
Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
Descrizione fisica | 1 online resource (283 pages) |
Disciplina | 410.5 |
Soggetto topico | Optical fibers |
ISBN | 3-030-92854-3 |
Formato | Materiale a stampa ![]() |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Intro -- Preface -- Contents -- 1 Current Development in the Field of Optical Short-Range Interconnects -- 1.1 Advantages of Optical Communication -- 1.2 3D-Opto-MID for Optical Bus Systems -- 1.2.1 Short-range optical waveguides networks -- 1.2.2 Optical bus systems -- 1.2.3 Current development in the field of 3D-Opto-MID -- 1.3 New Approach for Additive Manufactured 3D-Opto-MID -- References -- 2 Computer-Aided Design of Electro-Optical Assemblies -- Abstract -- 2.1 Demand on Software-Based Design Tools for Spatial Optoelectronics -- 2.2 State of the Art in the Design of Electro-optical Circuits and MID -- 2.2.1 General Procedures for Electronic and Electro-optical Assemblies -- 2.2.2 Electronics Design Process -- 2.2.3 Procedure for Spatial Electronic Assemblies (3D-MID) -- 2.2.4 Procedure in electro-optical design -- 2.2.5 Evaluation -- 2.3 Need for Action for the Computer-aided Modeling of 3D-Opto-MID -- 2.3.1 General Functional Requirements for a 3D Optomechatronic CAD System -- 2.3.2 General Aspects -- 2.3.2.1 Aspects of Design -- 2.3.2.2 Aspects Resulting from Manufacturing -- 2.3.2.3 Aspects of Software Systems -- 2.3.3 Summary -- 2.4 Concept of a Cross-domain Methodology for Optomechatronic Components -- 2.4.1 Considerations for the Design and Workflow of a Computer-aided 3D-Opto-MID System -- 2.4.2 Integration of Optical Functionalities in a 3D-OMCAD System -- 2.5 Prototypical Integration of Optomechatronic Functions into a 3D-Opto-MID Design System -- 2.5.1 Circuit Carrier and Substrate Modeling -- 2.5.2 Synthesis of Circuits -- 2.5.3 Waveguide Modeling, Routing Optimization and Wiring -- 2.5.3.1 Manual Routing -- 2.5.3.2 Automatic Routing -- 2.5.4 Design Rule Checks -- 2.5.5 Interface to Optical Simulation -- References -- 3 Three-Dimensional Simulations of Optical Multimode Waveguides -- 3.1 Demands on the Simulation.
3.2 Geometric Optical Simulation -- 3.2.1 State of the art for Raytracing -- 3.2.2 Mathematical Properties for the Description of a POW -- 3.2.3 Algorithm for Arbitrary Cross sections -- 3.2.4 Impact of Manufacturing Parameters on the Optical Properties -- 3.3 Physical Optical Simulation -- 3.3.1 State of the art for Wave Propagation Method (WPM) -- 3.3.2 Impact of Periodicity of Discrete Fourier Transform -- 3.3.3 Simulation of Waveguides -- References -- 4 Conditioning of Flexible Substrates for the Application of Optical Waveguides -- 4.1 Wetting Control by Conditioning -- 4.1.1 Wetting and Capillarity -- 4.1.2 Wetting Control by Changing the Chemical Properties -- 4.2 State of the art for Functional Flexographic Printing -- 4.2.1 Applications -- 4.2.2 Flexographic Printing Process -- 4.3 Selection and Design of the Printing Form -- 4.4 Characterization and Selection of the Materials -- 4.4.1 Selection of the Printing Varnish -- 4.4.2 Selection of the Substrate Material -- 4.5 Experimental Studies of the Conditioning Line Printing Process -- 4.5.1 Experimental Setup -- 4.5.2 Automated Evaluation of Geometric Quality -- 4.5.3 Geometry of the Conditioning Lines -- 4.5.4 Formation of Edge Ripples and Topography -- 4.6 Modeling of Stamp Deformation in the Printing Process -- 4.7 Manufacturing Three-Dimensional Optical Interconnects -- 4.7.1 Studies on the Thermoforming of Conditioned Film Substrates -- 4.8 Surface Functionalization for Wetting Behavior Adjustment of Flexographic Printing Forms -- 4.8.1 Functionalization by Laser-Induced Microstructures -- 4.8.2 Functionalization by Coating Mechanisms -- 4.8.3 Functionalization by Chemical Modification -- 4.8.4 Application of Functionalization Mechanisms on Flexographic Printing Forms and its Impact on the Printing Results -- 4.8.5 Impact of the Functionalization on the Printing Results -- References. 5 Aerosol Jet Printing of Polymer Optical Waveguides -- 5.1 State-of-the-Art Fabrication of the Polymer Optical Waveguide -- 5.1.1 Photolithography -- 5.1.2 Photolysis -- 5.1.3 Photolocking -- 5.1.4 Photobleaching -- 5.1.5 Reactive Ion Etching (RIE) -- 5.1.6 Laser Ablation -- 5.1.7 Dispense Printing -- 5.1.8 Mosquito Method -- 5.1.9 Inkjet Printing -- 5.1.10 Aerosol Jet Printing -- 5.2 Polymer Optical Waveguides Fabrication Through Aerosol Jet Printing -- 5.2.1 Principles of Aerosol Jet Printing -- 5.2.2 Selection of Polymer Optical Material for Aerosol Jet Printing Process -- 5.2.3 Effect of the Material Temperature on the Mass Flow Output -- 5.3 Fabrication Process Steps -- 5.3.1 Motion3D: CADCAM Design and NC Code Generation -- 5.3.2 Remote-NC: 5-Axes Kinematic System -- 5.3.3 AJP Process Parameter -- 5.4 Theoretical AJ Printed Polymer Optical Waveguide Geometry -- 5.5 Strategies in Aerosol Jet Printed Polymer Optical Waveguide -- 5.5.1 Single-layer Printing: Immediate UV Curing Process -- 5.5.2 Multi-layer Printing: Immediate UV Curing Process -- 5.5.3 Multi-layer Printing: UV Curing After the Complete Layer Printing -- 5.6 Qualification and Characterization of the Printed Polymer Optical Waveguide -- 5.6.1 Geometrical Properties -- 5.6.2 Profile Dimension -- 5.6.3 Effect of the Surface Roughness and Waviness -- 5.7 Morphology Analysis -- 5.7.1 Overspray -- 5.7.2 Waviness -- 5.7.3 Impurities -- 5.7.4 Bulging -- 5.7.5 Bubble or Air Pocket -- 5.8 Mechanical and Optical Properties of the Printed Polymer Optical Waveguide -- 5.8.1 Hot-Pin-Pull Test -- 5.8.2 Shear Force Test -- 5.8.3 Lifetime Performance Test -- 5.8.4 Optical Quality -- 5.9 Modeling and Simulation Analysis of the Aerosol Jet Printhead -- 5.9.1 Modeling and Operational Principles -- 5.9.2 Simulation Results Analysis -- 5.10 Summary -- References. 6 3D-Opto-MID Coupling Concept Using Printed Waveguides -- 6.1 Coupling Strategies for Large-Scale Optical Networks -- 6.1.1 Demands for Optical Bus Coupling -- 6.1.2 State of the Art for Optical Bus Couplers -- 6.1.3 Theoretical Basis for the Asymmetric Optical Bus Coupler -- 6.2 Simulation of the Asymmetric Optical Bus Coupler -- 6.2.1 Parameters for the Mathematical Model of the Bus Coupler -- 6.2.2 2D Simulation -- 6.2.3 3D Parameter Extension -- 6.2.4 3D Simulation -- 6.3 Performance of the Asymmetric Optical Bus Coupler -- 6.3.1 Measurement Setup -- 6.3.2 Coupling Results -- 6.3.3 Data Transmission via the Asymmetric Optical Bus Coupler -- 6.3.4 Long-Term Stability of the AOBC -- 6.4 Technologies for Three-Dimensional Electro-Optical Interconnects -- 6.4.1 Packaging Demands and State-Of-The-Art for 3D-Opto-MID -- 6.4.2 Polymer-Ceramic Hybrid Assembly for 3D-Opto-MID -- 6.4.3 Long-Term Stability of the 3D-Opto-MID -- References -- 7 Feasibility of Printed Optical Waveguides Over the Entire Process Chain by OPTAVER. |
Record Nr. | UNINA-9910633913503321 |
Cham, Switzerland : , : Springer, , [2022] | ||
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Lo trovi qui: Univ. Federico II | ||
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