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Adriani Heereboord, professoris (dum viveret) in academia patria philosophi Philosophia naturalis [[electronic resource] ] : cum commentariis peripateticis antehac edita
| Adriani Heereboord, professoris (dum viveret) in academia patria philosophi Philosophia naturalis [[electronic resource] ] : cum commentariis peripateticis antehac edita |
| Autore | Heereboord Adrianus <1614-1661.> |
| Edizione | [Nunc vero hac posthumâ editione mediam partem aucta & novis commentariis, partim è Nob. D. Cartesio, cl. Berigardo, H. Regio, alrisque præstantioribus philosophis, petititis, partim ex propria opinione dictatis explicata.] |
| Pubbl/distr/stampa | Londini, : Excusus & prostat venalis apud John. Wilmot & Joh. Crosley, 1684 |
| Descrizione fisica | 323, [6] p |
| Soggetto topico |
Science
Physics |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | lat |
| Record Nr. | UNISA-996393589703316 |
Heereboord Adrianus <1614-1661.>
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| Londini, : Excusus & prostat venalis apud John. Wilmot & Joh. Crosley, 1684 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Adriani Heereboord, professoris (dum viveret) in academia patria philosophi, Philosophia naturalis [[electronic resource] ] : cum commentariis peripateticis antehac edita / / Adriani Heereboord
| Adriani Heereboord, professoris (dum viveret) in academia patria philosophi, Philosophia naturalis [[electronic resource] ] : cum commentariis peripateticis antehac edita / / Adriani Heereboord |
| Autore | Heereboord Adrianus <1614-1661.> |
| Edizione | [Nunc vero, had posthumâ editione mediam partem aucta, & novis commentariis, partim è Nob. D. Cartesio, Cl. Berigardo, H. Regio, aliisque praestantioribus philosophis, petitis, partim ex propria opinione dictatis, explicata.] |
| Pubbl/distr/stampa | Oxoniae, : Typis Guil. Hall venales prostant apud Joh. Wilmot, MDCLXV [1665] |
| Descrizione fisica | [7], 256 p |
| Soggetto topico |
Science
Physics Philosophy |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | lat |
| Record Nr. | UNISA-996389243603316 |
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Heereboord Adrianus <1614-1661.>
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| Oxoniae, : Typis Guil. Hall venales prostant apud Joh. Wilmot, MDCLXV [1665] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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An Advanced Course in Computational Nuclear Physics [[electronic resource] ] : Bridging the Scales from Quarks to Neutron Stars / / edited by Morten Hjorth-Jensen, Maria Paola Lombardo, Ubirajara van Kolck
| An Advanced Course in Computational Nuclear Physics [[electronic resource] ] : Bridging the Scales from Quarks to Neutron Stars / / edited by Morten Hjorth-Jensen, Maria Paola Lombardo, Ubirajara van Kolck |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XVI, 644 p. 141 illus., 64 illus. in color.) |
| Disciplina | 539.7 |
| Collana | Lecture Notes in Physics |
| Soggetto topico |
Nuclear physics
Heavy ions Physics Astrophysics Elementary particles (Physics) Quantum field theory Nuclear Physics, Heavy Ions, Hadrons Numerical and Computational Physics, Simulation Astrophysics and Astroparticles Elementary Particles, Quantum Field Theory |
| ISBN | 3-319-53336-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Motivation and overarching aims -- Quantum Chromodynamics -- Lattice quantum chromodynamics. - General aspects of effective field theories and few-body applications -- Lattice methods and effective field theory -- Lattice methods and the nuclear few- and many-body problem -- Ab initio methods for nuclear structure and reactions: from few to manyNucleons -- Computational Nuclear Physics and Post Hartree-Fock Methods -- Variational and Diffusion Monte Carlo approaches to the nuclear few- and many-body problem -- In-medium SRG approaches to infinite nuclear matter -- Self-consistent Green’s function approaches. |
| Record Nr. | UNISA-996466831003316 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
An Advanced Course in Computational Nuclear Physics : Bridging the Scales from Quarks to Neutron Stars / / edited by Morten Hjorth-Jensen, Maria Paola Lombardo, Ubirajara van Kolck
| An Advanced Course in Computational Nuclear Physics : Bridging the Scales from Quarks to Neutron Stars / / edited by Morten Hjorth-Jensen, Maria Paola Lombardo, Ubirajara van Kolck |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XVI, 644 p. 141 illus., 64 illus. in color.) |
| Disciplina | 539.7 |
| Collana | Lecture Notes in Physics |
| Soggetto topico |
Nuclear physics
Heavy ions Physics Astrophysics Elementary particles (Physics) Quantum field theory Nuclear Physics, Heavy Ions, Hadrons Numerical and Computational Physics, Simulation Astrophysics and Astroparticles Elementary Particles, Quantum Field Theory |
| ISBN | 3-319-53336-3 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Motivation and overarching aims -- Quantum Chromodynamics -- Lattice quantum chromodynamics. - General aspects of effective field theories and few-body applications -- Lattice methods and effective field theory -- Lattice methods and the nuclear few- and many-body problem -- Ab initio methods for nuclear structure and reactions: from few to manyNucleons -- Computational Nuclear Physics and Post Hartree-Fock Methods -- Variational and Diffusion Monte Carlo approaches to the nuclear few- and many-body problem -- In-medium SRG approaches to infinite nuclear matter -- Self-consistent Green’s function approaches. |
| Record Nr. | UNINA-9910250049203321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Geometrical Optics / / by Psang Dain Lin
| Advanced Geometrical Optics / / by Psang Dain Lin |
| Autore | Lin Psang Dain |
| Edizione | [1st ed. 2017.] |
| Pubbl/distr/stampa | Singapore : , : Springer Singapore : , : Imprint : Springer, , 2017 |
| Descrizione fisica | 1 online resource (XXIV, 460 p. 222 illus., 193 illus. in color.) |
| Disciplina | 535.32 |
| Collana | Progress in Optical Science and Photonics |
| Soggetto topico |
Optics
Electrodynamics Physics Quantum optics Lasers Photonics Classical Electrodynamics Numerical and Computational Physics, Simulation Quantum Optics Optics, Lasers, Photonics, Optical Devices Mathematical Methods in Physics |
| ISBN | 981-10-2299-2 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Mathematical Background -- Skew-Ray Tracing of Geometrical Optics -- Geometrical Optical Model -- Ray tracing Equations for Paraxial Optics -- Cardinal Points and Image Equations -- Ray Aberrations -- Jacobian Matrix of Ray Ri with Respect to Incoming ray Ri-1 and Boundary Variable Vector Xi -- Jacobian Matrix of Boundary Variable Vector Xi¬ with Respect to System Variable Vector Xsys -- Prism Analysis -- Prism Design Based on Image Orientation -- Determination of Prism Reflectors to produce required image orientation -- Optically Stable Systems -- Point Spread Function, Caustic Surfaces and Modulation Transfer Function -- Optical Path Length and Its Jacobian Matrix -- Wavefront Aberration and Wavefront Shape -- Hessian Matrix of Ray Ri with Respect to Incoming ray Ri-1 and Boundary Variable Vector Xi -- Hessian Matrix of Boundary Variable Vector Xi with Respect to System Variable Vector Xsys -- Hessian Matrix of Optical Path Length. |
| Record Nr. | UNINA-9910135983303321 |
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Lin Psang Dain
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| Singapore : , : Springer Singapore : , : Imprint : Springer, , 2017 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Interconnect and Packaging / / Wensheng Zhao, editor
| Advanced Interconnect and Packaging / / Wensheng Zhao, editor |
| Pubbl/distr/stampa | Basel : , : MDPI - Multidisciplinary Digital Publishing Institute, , 2023 |
| Descrizione fisica | 1 online resource (266 pages) |
| Disciplina | 530 |
| Soggetto topico | Physics |
| ISBN | 3-0365-6732-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910683386403321 |
| Basel : , : MDPI - Multidisciplinary Digital Publishing Institute, , 2023 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Material and Device Applications with Germanium / / edited by Sanghyun Lee
| Advanced Material and Device Applications with Germanium / / edited by Sanghyun Lee |
| Pubbl/distr/stampa | [Place of publication not identified] : , : IntechOpen, , 2018 |
| Descrizione fisica | 1 online resource (100 pages) |
| Disciplina | 530 |
| Soggetto topico | Physics |
| ISBN |
1-83881-724-7
1-78984-032-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910317786203321 |
| [Place of publication not identified] : , : IntechOpen, , 2018 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced Materials : Physics, Mechanics and Applications / / edited by Shun-Hsyung Chang, Ivan A. Parinov, Vitaly Yu. Topolov
| Advanced Materials : Physics, Mechanics and Applications / / edited by Shun-Hsyung Chang, Ivan A. Parinov, Vitaly Yu. Topolov |
| Edizione | [1st ed. 2014.] |
| Pubbl/distr/stampa | Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 |
| Descrizione fisica | 1 online resource (378 p.) |
| Disciplina | 620.11 |
| Collana | Springer Proceedings in Physics |
| Soggetto topico |
Optical materials
Electronic materials Solid state physics Physics Ceramics Glass Composites (Materials) Composite materials Optical and Electronic Materials Solid State Physics Numerical and Computational Physics, Simulation Ceramics, Glass, Composites, Natural Materials |
| ISBN | 3-319-03749-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Processing Techniques of Advanced Materials -- Physics of Advanced Materials -- Mechanics of Advanced Materials -- Applications of Advanced Materials. |
| Record Nr. | UNINA-9910300380703321 |
| Cham : , : Springer International Publishing : , : Imprint : Springer, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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Advanced materials and components for 5G and beyond / / Colin Tong
| Advanced materials and components for 5G and beyond / / Colin Tong |
| Autore | Tong Xingcun Colin |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
| Descrizione fisica | 1 online resource (276 pages) |
| Disciplina | 405 |
| Collana | Springer Series in Materials Science |
| Soggetto topico | Physics |
| ISBN |
9783031172076
9783031172069 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- 2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications.
2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs. 4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems. 6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices. 8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index. |
| Record Nr. | UNISA-996499862603316 |
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Tong Xingcun Colin
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| Cham, Switzerland : , : Springer, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
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Advanced materials and components for 5G and beyond / / Colin Tong
| Advanced materials and components for 5G and beyond / / Colin Tong |
| Autore | Tong Xingcun Colin |
| Pubbl/distr/stampa | Cham, Switzerland : , : Springer, , [2022] |
| Descrizione fisica | 1 online resource (276 pages) |
| Disciplina | 405 |
| Collana | Springer Series in Materials Science |
| Soggetto topico | Physics |
| ISBN |
9783031172076
9783031172069 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
Intro -- Preface -- Contents -- Abbreviations -- About the Author -- Chapter 1: 5G Technology Components and Material Solutions for Hardware System Integration -- 1.1 Evolution of 5G Technology -- 1.2 5G Technology Components -- 1.2.1 5G Spectrum -- 1.2.2 Massive Multiple-Input Multiple-Output (MIMO) Antennas -- 1.2.3 Network Slicing -- 1.2.4 Dual Connectivity and Long Term Evolution (LTE) Coexistence -- 1.2.5 Support for Cloud Implementation and Edge Computing -- 1.3 Materials Solutions for 5G Hardware System Integration -- 1.3.1 Evolution of the Cellular Base Station and Its Construction Materials -- 1.3.2 Drivers to 5G Hardware System Integration -- 1.3.3 Materials and Electronic Components for 5G Packaging Technology -- 1.3.3.1 Packaging Requirements for 5G Systems -- 1.3.3.2 Dielectric Materials for 5G Module Packages -- 1.3.3.3 Microwave Circuit Design and Materials -- 1.3.3.4 Thermal Conductors and Thermal Management for 5G -- 1.3.3.5 Integration of Passive Components -- 1.3.3.5.1 Discrete Lumped Circuits for sub6 GHz 5G Bands -- 1.3.3.5.2 Distributed Components for mm-Wave -- 1.3.3.6 Antenna Systems in Package -- 1.3.3.7 High-Precision Patterning in Heterogeneous Package Integration for 5G -- 1.3.4 Nanomaterials for Nanoantennas in 5G -- 1.4 Challenges in 5G and Beyond - 6G -- 1.5 Outlook and Future Perspectives -- References -- Chapter 2: Semiconductor Solutions for 5G -- 2.1 Evolution of 5G Semiconductor Technologies -- 2.2 Effect of CMOS Technology Scaling on Millimeter Wave Operations -- 2.3 Distributed and Lumped Design Approaches for Fabricating Passives -- 2.3.1 Distributed Approach -- 2.3.2 Lumped approach -- 2.4 Comparison of Silicon and III-V Semiconductors -- 2.5 Transistor Model Design Challenge in CMOS Technology -- 2.6 GaN and GaN-on-SiC Wide Bandgap Semiconductors for 5G Applications.
2.6.1 Characteristics of GaN Devices Applied in 5G Technology -- 2.6.2 GaN Power Integration for MMIC in 5G Technology -- 2.6.2.1 GaN Power Integration for MMICS -- 2.6.2.2 GaN Base Station PAs -- 2.6.2.3 GaN Frequency Synthesis -- References -- Chapter 3: Design and Performance Enhancement for 5G Antennas -- 3.1 5G Antenna Classification -- 3.1.1 Classification Based on Input and Output Ports -- 3.1.2 Classification Based on Antenna Types -- 3.2 Performance Enhancement Techniques for 5G Antenna Design -- 3.2.1 General Antenna Performance Enhancement Techniques -- 3.2.2 Mutual Coupling Reduction (Decoupling) Techniques -- 3.3 Structural Design and Building Materials of 5G Antennas -- 3.3.1 SISO Wideband Antennas -- 3.3.1.1 Single Element Antenna -- 3.3.1.2 Multielement Antennas -- 3.3.2 SISO Multiband Antenna -- 3.3.3 MIMO Wideband Antennas -- 3.3.3.1 Multielement Without Metal Rim Antennas -- 3.3.3.1.1 Dual Element Antenna Without Metal Rim -- 3.3.3.1.2 Multielement Antenna Without Metal Rim -- 3.3.3.1.3 Multielement Antenna with Metal Rim -- 3.3.4 MIMO Multiband Antennas -- References -- Chapter 4: PCB Materials and Design Requirements for 5G Systems -- 4.1 The Evolution of Printed Circuit Boards -- 4.1.1 History -- 4.1.2 Materials and Fabrication Process -- 4.2 RF and High Frequency PCB Technologies -- 4.2.1 Basic Circuit Configuration of High-Frequency PCBs -- 4.2.2 Transmission Line Parameters Used in RF/High Frequency PCB Design -- 4.3 Designing High-Frequency PCBs -- 4.3.1 Variables Affecting the Performance of High-Frequency PCBs -- 4.3.2 High-Frequency PCB Layout Techniques -- 4.4 Materials Selection of PCBs for Millimeter Wave Applications -- 4.4.1 High-Frequency PCB Material Selection Guidelines -- 4.4.2 PCB Materials Used for High-Frequency Applications -- 4.4.2.1 PCB Substrate Materials -- 4.4.2.2 Conductors for High-Frequency PCBs. 4.5 The Role of Materials in High Frequency PCB Fabrication -- 4.6 Material Issues Related to 5G Applications -- 4.6.1 Mixed Signal Acceptance Circuit Board Designs -- 4.6.2 EMI Shielding Challenges -- 4.6.3 Impedance Control and Signal Loss -- 4.6.4 Thermal Management Challenges -- 4.6.5 Moisture Absorption -- References -- Chapter 5: Materials for High Frequency Filters -- 5.1 The 5G Effect on Filter Technologies -- 5.1.1 Current Status of Mobile Device Filter Technologies -- 5.1.2 The 5G Filter Performance Challenges -- 5.1.2.1 The 5G Frequency Spectrum -- 5.1.2.2 The 5G Filter Requirements -- 5.1.2.3 Physical Design and Emerging Solutions for the 5G Filters -- 5.2 Materials and Design for Acoustic Filters -- 5.2.1 Current Application and Band Allocation of Acoustic Filter Technology -- 5.2.2 Basic Working Principle of the BAW Filter -- 5.2.2.1 Structure of the BAW Resonator -- 5.2.2.2 Key Parameters of the BAW Resonator -- 5.2.2.3 Topology of the BAW Filter -- 5.2.3 Materials for the BAW Resonator -- 5.2.3.1 Piezoelectric Materials -- 5.2.3.2 Electrode Materials -- 5.2.4 Temperature Compensation -- 5.2.5 Frequency Tenability -- 5.2.6 Lithium Niobate and Laterally Excited Bulk-Wave Resonators (XBAR) -- 5.3 Microwave and Millimeter Wave Filters Based on MEMS Technology -- 5.3.1 Micromachined Filters -- 5.3.1.1 Surface Micromachining Superconductor Filters -- 5.3.1.2 Planar Microstrip Filters -- 5.3.1.3 Coplanar Waveguide Filters -- 5.3.1.4 Micromachined Dielectric Waveguide Resonate Filters -- 5.3.2 Micromachined Tunable Filters -- 5.4 Metamaterial and Metasurface Filters for 5G Communications -- References -- Chapter 6: EMI Shielding Materials and Absorbers for 5G Communications -- 6.1 EMI Shielding Design Principle in 5G Systems -- 6.2 Component Package-Level EMI Shielding for 5G Modules -- 6.3 Board Level EMI Shielding for 5G Systems. 6.4 Design and Materials Selection for 5G Absorbers -- 6.5 Advanced Metallic Composite Materials for High-Frequency EMI Shielding -- 6.5.1 Hollow and Porous Metal-Based EMI Shielding Materials -- 6.5.2 Metal-Based EMI Shielding Composites with Frequency-Selective Transmission -- 6.5.3 Particle-Based EMI Shielding Metallic Composites -- 6.5.4 MXene-Based EMI Shielding Composites -- 6.5.5 Metal-Based Flexible EMI Shielding Materials -- 6.6 Emerging Polymer-Based EMI Shielding and Absorber Materials -- References -- Chapter 7: Thermal Management Materials and Components for 5G Devices -- 7.1 Thermal Management Challenges and Strategies in 5G Devices -- 7.1.1 Form Factor-Constrained Thermal Management Solutions -- 7.1.2 5G Mobile Device Level Thermal Management -- 7.1.3 Base Station Level Thermal Management -- 7.1.4 Emerging Thermal Management Challenges and Strategies -- 7.2 Thermal Management Materials and Components for 5G-Enabled Mobile Devices -- 7.2.1 Thermal Management Design and Fundamental Solutions for Smartphones -- 7.2.1.1 Thermal Management Design Guideline -- 7.2.1.2 Fundamental Thermal Management Solutions -- 7.2.1.2.1 Heat Conduction and Spreading -- 7.2.1.2.2 Convective Air Cooling -- 7.2.1.2.3 Convective Liquid Cooling -- 7.2.2 Material Selection for Heat Spreaders and Heat Sinks -- 7.2.3 Flat Plate Heat Pipes and Vapor Chambers for Mobile Electronic Devices -- 7.2.4 Thermal Interface Materials -- 7.2.5 Thermal Insulation Materials -- 7.2.6 Thermal Metamaterials -- 7.3 Thermal Management of 5G Base Station Antenna Arrays -- 7.3.1 Cooling in Traditional AESA's -- 7.3.2 Cooling in Planar AESA's -- 7.3.3 Antenna Array Cooling at Millimeter Waves -- 7.4 Thermal Management of 5G Edge Computing -- References -- Chapter 8: Protective Packaging and Sealing Materials for 5G Mobile Devices. 8.1 Design of 5G Millimeter Wave Compatible Covers for High-End Mobile Devices -- 8.1.1 Dielectric Cover Design -- 8.1.2 Metallic Cover Design with Inserted Dielectric Slots -- 8.1.3 Integration Design Consideration -- 8.2 Thin Film Encapsulation in 5G Electronic Packaging -- 8.3 Adhesives and Sealants for 5G Systems -- References -- Chapter 9: Perspectives on 5G and Beyond Applications and Related Technologies -- 9.1 Applications in Industry Verticals and Their Needs -- 9.1.1 5G in Automotive -- 9.1.2 Big Data Analytics in 5G -- 9.1.3 5G Emergency Communications -- 9.1.4 Future Factories Enabled by 5G Technology -- 9.1.5 Smart Health-Care Network Based on 5G -- 9.1.6 5G Technology for Smart Energy Management and Smart Cities -- 9.1.6.1 5G Technology for Smart Cities -- 9.1.6.2 Applications of 5G Technology in the Construction Industry and Infrastructures -- 9.1.6.3 Smart Building System Integrated with 5G Communication Technology -- 9.2 Perspectives on 6G Wireless Communications -- 9.3 Challenges and Prospects of Core Materials and Components for 5G and Beyond -- 9.3.1 Ultralow-Loss High-Reliability Copper-Clad Laminates -- 9.3.2 5G Metamaterials and Low-Loss High-Performance RF Technology -- 9.3.3 5G Low-Loss Magnetoelectric Functional Materials and Devices -- 9.3.4 Multimodule Integrated Printed Circuit Boards -- 9.3.5 Manufacturing Technology of Photoelectric Integrated Cables -- 9.3.6 Photonics-Assisted Ultrabroadband RF Transceiver Integrated Modules -- 9.3.7 All-Optical Network and Superlarge-Core Fiber Optic Cables -- References -- Index. |
| Record Nr. | UNINA-9910631092503321 |
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Tong Xingcun Colin
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| Cham, Switzerland : , : Springer, , [2022] | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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