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Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2007
Descrizione fisica 1 online resource (80 p.)
Disciplina 331.1330973
Altri autori (Persone) EngestromYrjo
KerosuoHannele
Collana Journal of Workplace Learning
Soggetto topico Employees - Training of
Occupational training
Soggetto genere / forma Electronic books.
ISBN 1-281-07916-2
9786611079161
1-84663-577-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization
Record Nr. UNINA-9910450875403321
Bradford, England, : Emerald Group Publishing, c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2007
Descrizione fisica 1 online resource (80 p.)
Disciplina 331.1330973
Altri autori (Persone) EngestromYrjo
KerosuoHannele
Collana Journal of Workplace Learning
Soggetto topico Employees - Training of
Occupational training
ISBN 1-281-07916-2
9786611079161
1-84663-577-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization
Record Nr. UNINA-9910777045703321
Bradford, England, : Emerald Group Publishing, c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2007
Descrizione fisica 1 online resource (80 p.)
Disciplina 331.1330973
Altri autori (Persone) EngestromYrjo
KerosuoHannele
Collana Journal of Workplace Learning
Soggetto topico Employees - Training of
Occupational training
ISBN 1-281-07916-2
9786611079161
1-84663-577-2
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization
Record Nr. UNINA-9910812229103321
Bradford, England, : Emerald Group Publishing, c2007
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2003
Descrizione fisica 1 online resource (102 p.)
Disciplina 670.42
Altri autori (Persone) MesslerDr. Robert W
Collana Assembly automation
Soggetto topico Automation
Mechanical engineering
Soggetto genere / forma Electronic books.
ISBN 1-280-51069-2
9786610510696
1-84544-446-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary;
Record Nr. UNINA-9910449682303321
Bradford, England, : Emerald Group Publishing, c2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2003
Descrizione fisica 1 online resource (102 p.)
Disciplina 670.42
Altri autori (Persone) MesslerDr. Robert W
Collana Assembly automation
Soggetto topico Automation
Mechanical engineering
ISBN 1-280-51069-2
9786610510696
1-84544-446-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary;
Record Nr. UNINA-9910777380403321
Bradford, England, : Emerald Group Publishing, c2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2003
Descrizione fisica 1 online resource (102 p.)
Disciplina 670.42
Altri autori (Persone) MesslerDr. Robert W
Collana Assembly automation
Soggetto topico Automation
Mechanical engineering
ISBN 1-280-51069-2
9786610510696
1-84544-446-9
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary;
Record Nr. UNINA-9910829171203321
Bradford, England, : Emerald Group Publishing, c2003
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2006
Descrizione fisica 1 online resource (72 p.)
Disciplina 621.381/046
Altri autori (Persone) BaileyChristopher
LiuJohan
Collana Soldering & surface mount technology
Soggetto topico Manufacturing processes
Electronic packaging
Soggetto genere / forma Electronic books.
ISBN 1-280-54757-X
9786610547579
1-84663-011-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary
Record Nr. UNINA-9910450385003321
Bradford, England, : Emerald Group Publishing, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2006
Descrizione fisica 1 online resource (72 p.)
Disciplina 621.381/046
Altri autori (Persone) BaileyChristopher
LiuJohan
Collana Soldering & surface mount technology
Soggetto topico Manufacturing processes
Electronic packaging
ISBN 1-280-54757-X
9786610547579
1-84663-011-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary
Record Nr. UNINA-9910783539503321
Bradford, England, : Emerald Group Publishing, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2006
Descrizione fisica 1 online resource (72 p.)
Disciplina 621.381/046
Altri autori (Persone) BaileyChristopher
LiuJohan
Collana Soldering & surface mount technology
Soggetto topico Manufacturing processes
Electronic packaging
ISBN 1-280-54757-X
9786610547579
1-84663-011-8
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary
Record Nr. UNINA-9910825844003321
Bradford, England, : Emerald Group Publishing, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advanced reliability modeling [[electronic resource] ] : part II / / guest editors: Tadashi Dohi, Naoto Kaio and Won Young Yun
Advanced reliability modeling [[electronic resource] ] : part II / / guest editors: Tadashi Dohi, Naoto Kaio and Won Young Yun
Pubbl/distr/stampa Bradford, England, : Emerald Group Publishing, c2006
Descrizione fisica 1 online resource (101 p.)
Altri autori (Persone) DohiTadashi
KaioNaoto
YunWon Young
Collana Journal of Quality in Maintenance Engineering
Soggetto topico Reliability (Engineering) - Mathematical models
Computer networks - Reliability
Soggetto genere / forma Electronic books.
ISBN 1-280-73763-8
9786610737635
1-84663-195-5
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Nota di contenuto Cover; CONTENTS; EDITORIAL ADVISORY BOARD; Editorial; Genetic search for redundancy optimization in complex systems; Reliability-redundancy optimization using simulated annealing algorithms; Calculating top event probability of a fault tree with many repeated events; Acceptance sampling plans based on failure-censored step-stress accelerated tests for Weibull distributions; Reliability design of industrial plants using Petri nets; Stochastic performance evaluation for multi-task processing system with software availability model
Software reliability modeling in distributed development environment
Record Nr. UNINA-9910450730603321
Bradford, England, : Emerald Group Publishing, c2006
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui