Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2007 |
Descrizione fisica | 1 online resource (80 p.) |
Disciplina | 331.1330973 |
Altri autori (Persone) |
EngestromYrjo
KerosuoHannele |
Collana | Journal of Workplace Learning |
Soggetto topico |
Employees - Training of
Occupational training |
Soggetto genere / forma | Electronic books. |
ISBN |
1-281-07916-2
9786611079161 1-84663-577-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization |
Record Nr. | UNINA-9910450875403321 |
Bradford, England, : Emerald Group Publishing, c2007 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2007 |
Descrizione fisica | 1 online resource (80 p.) |
Disciplina | 331.1330973 |
Altri autori (Persone) |
EngestromYrjo
KerosuoHannele |
Collana | Journal of Workplace Learning |
Soggetto topico |
Employees - Training of
Occupational training |
ISBN |
1-281-07916-2
9786611079161 1-84663-577-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization |
Record Nr. | UNINA-9910777045703321 |
Bradford, England, : Emerald Group Publishing, c2007 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Activity theory and workplace learning [[electronic resource] /] / guest editors: Yrjo Engestrom and Hannele Kerosuo |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2007 |
Descrizione fisica | 1 online resource (80 p.) |
Disciplina | 331.1330973 |
Altri autori (Persone) |
EngestromYrjo
KerosuoHannele |
Collana | Journal of Workplace Learning |
Soggetto topico |
Employees - Training of
Occupational training |
ISBN |
1-281-07916-2
9786611079161 1-84663-577-2 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Cover; CONTENTS; Editorial advisory board; From workplace learning to inter-organizational learning and back: the contribution of activity theory; Inter-organizational learning across levels: an object-oriented approach; Workplace learning in the New Zealand apple industry network; Analysing third generation activity systems: labour-power, subject position and personal transformation; E-learning in a large organization |
Record Nr. | UNINA-9910812229103321 |
Bradford, England, : Emerald Group Publishing, c2007 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2003 |
Descrizione fisica | 1 online resource (102 p.) |
Disciplina | 670.42 |
Altri autori (Persone) | MesslerDr. Robert W |
Collana | Assembly automation |
Soggetto topico |
Automation
Mechanical engineering |
Soggetto genere / forma | Electronic books. |
ISBN |
1-280-51069-2
9786610510696 1-84544-446-9 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary; |
Record Nr. | UNINA-9910449682303321 |
Bradford, England, : Emerald Group Publishing, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2003 |
Descrizione fisica | 1 online resource (102 p.) |
Disciplina | 670.42 |
Altri autori (Persone) | MesslerDr. Robert W |
Collana | Assembly automation |
Soggetto topico |
Automation
Mechanical engineering |
ISBN |
1-280-51069-2
9786610510696 1-84544-446-9 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary; |
Record Nr. | UNINA-9910777380403321 |
Bradford, England, : Emerald Group Publishing, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Adhesives + welding + joining [[electronic resource] /] / guest specialist, Robert W. Messler |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2003 |
Descrizione fisica | 1 online resource (102 p.) |
Disciplina | 670.42 |
Altri autori (Persone) | MesslerDr. Robert W |
Collana | Assembly automation |
Soggetto topico |
Automation
Mechanical engineering |
ISBN |
1-280-51069-2
9786610510696 1-84544-446-9 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto | Abstracts & keywords; Editorial; Viewpoint; Company news; Keynote; Features; Research articles; Mini features; New products; Internet page; Book reviews; Patent abstracts; Diary; |
Record Nr. | UNINA-9910829171203321 |
Bradford, England, : Emerald Group Publishing, c2003 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
Descrizione fisica | 1 online resource (72 p.) |
Disciplina | 621.381/046 |
Altri autori (Persone) |
BaileyChristopher
LiuJohan |
Collana | Soldering & surface mount technology |
Soggetto topico |
Manufacturing processes
Electronic packaging |
Soggetto genere / forma | Electronic books. |
ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
Record Nr. | UNINA-9910450385003321 |
Bradford, England, : Emerald Group Publishing, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
Descrizione fisica | 1 online resource (72 p.) |
Disciplina | 621.381/046 |
Altri autori (Persone) |
BaileyChristopher
LiuJohan |
Collana | Soldering & surface mount technology |
Soggetto topico |
Manufacturing processes
Electronic packaging |
ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
Record Nr. | UNINA-9910783539503321 |
Bradford, England, : Emerald Group Publishing, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging [[electronic resource] /] / guest editors Christopher Bailey and Johan Liu |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
Descrizione fisica | 1 online resource (72 p.) |
Disciplina | 621.381/046 |
Altri autori (Persone) |
BaileyChristopher
LiuJohan |
Collana | Soldering & surface mount technology |
Soggetto topico |
Manufacturing processes
Electronic packaging |
ISBN |
1-280-54757-X
9786610547579 1-84663-011-8 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binder
Finite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diary |
Record Nr. | UNINA-9910825844003321 |
Bradford, England, : Emerald Group Publishing, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
|
Advanced reliability modeling [[electronic resource] ] : part II / / guest editors: Tadashi Dohi, Naoto Kaio and Won Young Yun |
Pubbl/distr/stampa | Bradford, England, : Emerald Group Publishing, c2006 |
Descrizione fisica | 1 online resource (101 p.) |
Altri autori (Persone) |
DohiTadashi
KaioNaoto YunWon Young |
Collana | Journal of Quality in Maintenance Engineering |
Soggetto topico |
Reliability (Engineering) - Mathematical models
Computer networks - Reliability |
Soggetto genere / forma | Electronic books. |
ISBN |
1-280-73763-8
9786610737635 1-84663-195-5 |
Formato | Materiale a stampa |
Livello bibliografico | Monografia |
Lingua di pubblicazione | eng |
Nota di contenuto |
Cover; CONTENTS; EDITORIAL ADVISORY BOARD; Editorial; Genetic search for redundancy optimization in complex systems; Reliability-redundancy optimization using simulated annealing algorithms; Calculating top event probability of a fault tree with many repeated events; Acceptance sampling plans based on failure-censored step-stress accelerated tests for Weibull distributions; Reliability design of industrial plants using Petri nets; Stochastic performance evaluation for multi-task processing system with software availability model
Software reliability modeling in distributed development environment |
Record Nr. | UNINA-9910450730603321 |
Bradford, England, : Emerald Group Publishing, c2006 | ||
Materiale a stampa | ||
Lo trovi qui: Univ. Federico II | ||
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