LTB-3D : 2019 6th International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, May 21 -25, 2019, Kanazawa, Ishikawa, Japan / / Institute of Electrical and Electronics Engineers
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| Titolo: |
LTB-3D : 2019 6th International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, May 21 -25, 2019, Kanazawa, Ishikawa, Japan / / Institute of Electrical and Electronics Engineers
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| Pubblicazione: | Piscataway, New Jersey : , : Institute of Electrical and Electronics Engineers, , 2019 |
| Descrizione fisica: | 1 online resource (90 pages) |
| Disciplina: | 621.885 |
| Soggetto topico: | Three-dimensional integrated circuits |
| Sealing (Technology) | |
| Photonics - Materials | |
| Titolo autorizzato: | LTB-3D |
| ISBN: | 4-904743-07-5 |
| Formato: | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione: | Inglese |
| Record Nr.: | 996577920603316 |
| Lo trovi qui: | Univ. di Salerno |
| Opac: | Controlla la disponibilità qui |