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VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers / / edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha



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Autore: Elfadel Ibrahim (Abe) M Visualizza persona
Titolo: VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence : 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers / / edited by Ibrahim (Abe) M. Elfadel, Lutfi Albasha Visualizza cluster
Pubblicazione: Cham : , : Springer Nature Switzerland : , : Imprint : Springer, , 2024
Edizione: 1st ed. 2024.
Descrizione fisica: 1 online resource (322 pages)
Disciplina: 621.39
004.6
Soggetto topico: Computer engineering
Computer networks
Software engineering
Computers
Computer Engineering and Networks
Software Engineering
Computer Hardware
Altri autori: AlbashaLutfi  
Nota di contenuto: Architectures -- Synthesis of SFQ Circuits with Compound Gates -- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures -- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories -- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure -- Accelerators -- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility -- Accelerating Large Kernel Convolutions with Nested Winograd Transformation -- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator -- Resiliency and Robustness -- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats -- Advanced Quality Assurance Platform for Robust Process Design Kits -- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products -- Radiation Tolerant 14T SRAM Cell for Avionics Applications -- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.-Security and Privacy -- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow’s Advanced Memory Range Feature -- Confidential Inference in Decision Trees -- Enhancing the Security of IJTAG network using Inherently Secure SIB.
Sommario/riassunto: This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023. The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
Titolo autorizzato: VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence  Visualizza cluster
ISBN: 9783031709470
3031709470
Formato: Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione: Inglese
Record Nr.: 9910920444703321
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Serie: IFIP Advances in Information and Communication Technology, . 1868-422X ; ; 680
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