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Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / / Er-Ping Li
| Electrical modeling and design for 3D integration : 3D integrated circuits and packaging signal integrity, power integrity, and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | Hoboken, N.J., : Wiley, c2012 |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3815 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910877850903321 |
Li Er-Ping
|
||
| Hoboken, N.J., : Wiley, c2012 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910141296603321 |
|
Li Er-Ping
|
||
| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li
| Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC / / Er-Ping Li |
| Autore | Li Er-Ping |
| Pubbl/distr/stampa | [United States] : , : IEEE Press |
| Descrizione fisica | 1 online resource (390 p.) |
| Disciplina | 621.3015118 |
| Soggetto topico |
Three-dimensional integrated circuits
Integrated circuits |
| ISBN |
1-280-67311-7
9786613650047 1-118-16674-4 1-118-16672-8 1-118-16675-2 |
| Classificazione | TEC008050 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto | Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration. |
| Record Nr. | UNINA-9910830908503321 |
|
Li Er-Ping
|
||
| [United States] : , : IEEE Press | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||