Info
- Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.
Additive Manufacturing: Alloy Design and Process Innovations . Vol. 2
| Additive Manufacturing: Alloy Design and Process Innovations . Vol. 2 |
| Autore | Wang Zhi |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (352 p.) |
| Soggetto non controllato |
microstructure
slag crystallographic texture epoxy solder additive manufacturing substrate preheating thermosetting epoxy resin AlSi10Mg alloy impact residual stress stability lobe diagram laves phase vanadium selective laser melting (SLM) molten pool dynamic behavior scanning strategy pulse frequency thin-walled weak rigidity parts scanning aluminum elastic abrasive 2219 aluminum alloy Powder bed ABS laser energy density equivalent processing model composition numerical analysis scanning electron microscopy (SEM) Hastelloy X alloy regular mixing texture evolution graphene nano-sheets (GNSs) Electron Beam Melting powder bed fusion microstructural evolution Mg content cement bulk metallic glasses grain refinement Taguchi intermediate thermo-mechanical treatment valorization microstructure and properties arc current high computational efficiency powder properties dynamic characteristics composite materials CuAl2 phase rapid solidification magnetizer M300 mold steel circular economy titanium alloy Al-5Si alloy Al-Mg-Si alloy ultrasonic bonding water absorption disc brake support strategy inoculation arc additive manufacture 3D metal printing ultrafast laser Hot Isostatic Pressure arc additive manufacturing continuous carbon fiber performance characteristics process-damping intermetallic compound (IMC) interfaces direct metal laser sintering porosity nickel-based superalloy element segregation hydrophobicity H13 tool steel Cu50Zr43Al7 metal powders parameter optimization side spatters powder packing 3D printing precipitates simulation laser cladding deposition melt pool size quenching rate Al-Mg alloy tailored properties workpiece scale fatigue laser cladding Ti-6Al-4V deformation quality of the as-built parts model milling wire feeding additive manufacturing martensitic transformation ball milling Inconel 718 ablation in-process temperature in MPBAM subgranular dendrites porosity reduction femtosecond paint bake-hardening Al6061 defects continuous dynamic recrystallization wear Additive manufacturing volumetric heat source Ti6Al4V alloy AlSi10Mg radial grooves GH4169 temperature and stress fields laser powder bed fusion metallic glasses numerical simulation latent heat divisional scanning wire lateral feeding laser powder bed fusion (LPBF) heat treatment thermal behaviour fused filament fabrication microstructures thermal conductivity 12CrNi2 alloy steel powder tensile strength hot stamping steel blanks multi-laser manufacturing aluminum alloys additive surface structuring parts design process parameters thermal stress analysis SLM process parameters nickel alloys Al-Si powder flowability laser power absorption refractory high-entropy alloy localized inductive heating mechanical properties selective laser melting storage energy concrete mechanical property gray cast iron constitutive model analytical modeling hot deformation epitaxial growth design flowability amorphous alloy PSO-BP neural network algorithm molten pool evolution microhardness measurement macro defects thermal capillary effects finite element analysis dynamic properties WxNbMoTa properties |
| ISBN | 3-03928-415-0 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Additive Manufacturing |
| Record Nr. | UNINA-9910404089103321 |
Wang Zhi
|
||
| MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Additive Manufacturing: Alloy Design and Process Innovations . Vol. 1
| Additive Manufacturing: Alloy Design and Process Innovations . Vol. 1 |
| Autore | Wang Zhi |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (372 p.) |
| Soggetto non controllato |
microstructure
slag crystallographic texture epoxy solder additive manufacturing substrate preheating thermosetting epoxy resin AlSi10Mg alloy impact residual stress stability lobe diagram laves phase vanadium selective laser melting (SLM) molten pool dynamic behavior scanning strategy pulse frequency thin-walled weak rigidity parts scanning aluminum elastic abrasive 2219 aluminum alloy Powder bed ABS laser energy density equivalent processing model composition numerical analysis scanning electron microscopy (SEM) Hastelloy X alloy regular mixing texture evolution graphene nano-sheets (GNSs) Electron Beam Melting powder bed fusion microstructural evolution Mg content cement bulk metallic glasses grain refinement Taguchi intermediate thermo-mechanical treatment valorization microstructure and properties arc current high computational efficiency powder properties dynamic characteristics composite materials CuAl2 phase rapid solidification magnetizer M300 mold steel circular economy titanium alloy Al-5Si alloy Al-Mg-Si alloy ultrasonic bonding water absorption disc brake support strategy inoculation arc additive manufacture 3D metal printing ultrafast laser Hot Isostatic Pressure arc additive manufacturing continuous carbon fiber performance characteristics process-damping intermetallic compound (IMC) interfaces direct metal laser sintering porosity nickel-based superalloy element segregation hydrophobicity H13 tool steel Cu50Zr43Al7 metal powders parameter optimization side spatters powder packing 3D printing precipitates simulation laser cladding deposition melt pool size quenching rate Al-Mg alloy tailored properties workpiece scale fatigue laser cladding Ti-6Al-4V deformation quality of the as-built parts model milling wire feeding additive manufacturing martensitic transformation ball milling Inconel 718 ablation in-process temperature in MPBAM subgranular dendrites porosity reduction femtosecond paint bake-hardening Al6061 defects continuous dynamic recrystallization wear Additive manufacturing volumetric heat source Ti6Al4V alloy AlSi10Mg radial grooves GH4169 temperature and stress fields laser powder bed fusion metallic glasses numerical simulation latent heat divisional scanning wire lateral feeding laser powder bed fusion (LPBF) heat treatment thermal behaviour fused filament fabrication microstructures thermal conductivity 12CrNi2 alloy steel powder tensile strength hot stamping steel blanks multi-laser manufacturing aluminum alloys additive surface structuring parts design process parameters thermal stress analysis SLM process parameters nickel alloys Al-Si powder flowability laser power absorption refractory high-entropy alloy localized inductive heating mechanical properties selective laser melting storage energy concrete mechanical property gray cast iron constitutive model analytical modeling hot deformation epitaxial growth design flowability amorphous alloy PSO-BP neural network algorithm molten pool evolution microhardness measurement macro defects thermal capillary effects finite element analysis dynamic properties WxNbMoTa properties |
| ISBN | 3-03928-353-7 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti | Additive Manufacturing |
| Record Nr. | UNINA-9910404089203321 |
|
Wang Zhi
|
||
| MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 electronic resource (210 p.) |
| Soggetto topico |
Research & information: general
Biology, life sciences |
| Soggetto non controllato |
heterogeneous integration
wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
|
Seok Seonho
|
||
| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
Science, Characterization and Technology of Joining and Welding
| Science, Characterization and Technology of Joining and Welding |
| Autore | Haghshenas Meysam |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (251 p.) |
| Soggetto non controllato |
microstructure
phased array ultrasonic thermophysical property FRP simulation eutectoid tint etching TAN alloy dissimilar material joining thermal compression bonding HAZ cracking welding thermal cycles IN738 superalloy carbide dissolution solder friction bit joining weld bonding interfacial microstructure adhesive thermos-mechanical property API 5L X80 steel scarf joint thermal spraying pores Cr-Mo steel welding hot pressing local brittle zone electrical properties Ti2AlNb alloy tool pin profiles adhesive bonding mechanical properties carbon fiber-reinforced polymer surface structuring m23c6 Zn-coated low carbon microalloyed steels flux-less soldering dissimilar joints energy-input medium thick plate model design of experiments oxide layer mechanical interlocking rotary friction-welding 22MnB5 ultrasonic bonding titanium anisotropy coupled arc heat-affected zone aluminum plasma-TIG joint mechanical properties hybrid joining microconstituent dual-phase steel high-crystalline content zirconia flex-on-board assembly active monomers butt joint copper clad filler foil SA213-T23 arc profile numerical simulation tailor welded blanks ceramics vacuum brazing coating longitudinal wave direct diffusion bonding metallurgy pressure distribution flow stress SnBi58 solder joint morphology adhesion dissimilar weldments laser welding distributed point heat sources model mechanical strength taguchi design bonding strength friction stir welding |
| ISBN | 3-03928-998-5 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910404080103321 |
|
Haghshenas Meysam
|
||
| MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||