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Advances in Micro and Nano Manufacturing: Process Modeling and Applications
Advances in Micro and Nano Manufacturing: Process Modeling and Applications
Autore Masato Davide
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (204 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato modular microfluidic system
3D printing
gel microspheres
laser-induced periodical surface structures
micro-injection molding
replication
surface wettability
micro-groove
electrochemical machining
porous cathode
conductive mask
machining localization
dimensional uniformity
nanogrinding
abrasive grains
rake angle
spacing
grinding forces
grinding temperature
chip formation
subsurface damage
micro injection molding
additive manufacturing
stereolithography
K9 glass
mathematical model
grinding force
brittle fracture
ductile-brittle transition
active grains number
lithography simulation
microelectromechanical system
waveguide method
microstructure
radial ultrasonic rolling electrochemical micromachining (RUR-EMM)
material removal amount
surface roughness
response surface methodology (RSM)
turning
minimum chip thickness
micromachining
femtosecond micromachining
burst processing
intraocular lens
hydrophilic acrylic
polishing
laser assisted turning
tungsten carbide
diamond turning
finite element analysis
prostheses
ITAP
micro topology
ANSYS
MATLAB
additive manufacture
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Advances in Micro and Nano Manufacturing
Record Nr. UNINA-9910557612503321
Masato Davide  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Frontiers in Ultra-Precision Machining
Frontiers in Ultra-Precision Machining
Autore Guo Jiang
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 electronic resource (246 p.)
Soggetto topico Technology: general issues
History of engineering & technology
Soggetto non controllato fused silica
small-scale damage
magnetorheological removing method
combined repairing process
evolution law
diamond grinding
single crystal silicon
subsurface damage
crystal orientation
spherical shell
thin-walled part
wall-thickness
benchmark coincidence
data processing
ultra-precision machining
computer-controlled optical surfacing
dwell time algorithm
removal function
elementary approximation
atmospheric pressure plasma jet
continuous phase plate
surface topography
high accuracy and efficiency
polar microstructures
optimization
machining parameters
cutting strategy
flexible grinding
shear thickening fluid
cluster effect
high-shear low-pressure
aluminum
ion beam sputtering
morphology evolution
molecular dynamics
electrochemical discharge machining (ECDM)
material removal rate (MRR)
electrode wear ratio (EWR)
overcut (OC)
electrical properties
tool material
diamond tool
single-point diamond turning
lubricant
ferrous metal
electrorheological polishing
polishing tool
roughness
integrated electrode
Nano-ZrO2 ceramics
ultra-precision grinding
surface residual material
surface quality
three-dimensional surface roughness
reversal method
eccentricity
piezoelectric actuator
flange
dynamic modeling
surface characterization
cutting forces
tool servo diamond cutting
data-dependent systems
surface topography variation
microstructured surfaces
microlens array
three-dimensional elliptical vibration cutting
piezoelectric hysteresis
Bouc-Wen model
flower pollination algorithm
dynamic switching probability strategy
parameter identification
atom probe tomography (APT)
single-wedge
lift-out
focused ion beam (FIB)
Al/Ni multilayers
vibration-assisted electrochemical machining (ECM)
blisk
narrow channel
high aspect ratio
multi-physics coupling simulation
machining stability
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910566486003321
Guo Jiang  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui