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Fatigue and Fracture of Non-metallic Materials and Structures
| Fatigue and Fracture of Non-metallic Materials and Structures |
| Autore | Spagnoli Andrea |
| Pubbl/distr/stampa | Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 |
| Descrizione fisica | 1 electronic resource (586 p.) |
| Soggetto topico | History of engineering & technology |
| Soggetto non controllato |
Ethylene-propylene diene monomer rubber EPDM
grommet physical properties optimization of shape design reliability of rocks fatigue load strain energy red sandstone distribution of strain energy indices multi-scale simulation fatigue loading road bridge decks stagnant water fracture toughness blast furnace slag particle size compressive strength concrete concrete cracking crack patterns carbon fiber-reinforced polymers-CFRP RC strengthening (in bending and shear) RC beams soft materials polymers strain rate defect tolerance digital image correlation stress concentrators notch blunting lightning strike composite reinforced panel blow-off impulse electric-thermal coupling boundary effect size effect tensile strength physical modelling test rock structure fracture deformation mining neutral axis self-healing successive strain gauge flexural test bridge decks pseudo-cracking method data assimilation triaxial compression test sandstone rock mechanics rock fracture energy evolution rock-like material crack propagation discrete element strain rate tensor velocity field jointed rock uniaxial tension loading numerical analysis discrete element method strata structural behavior numerical simulation tension weakening fractures goaf consolidation fatigue life modified asphalt mixture four-point bending beam fatigue test two-point trapezoidal beam fatigue test overlay tester embedment shale rock proppant pack fracture width fly ash fineness fracture energy critical stress intensity factor assessment bridge evaluation compressive membrane action concrete bridges fatigue fatigue assessment live loads prestressed concrete punching shear scale model CFRP Low Velocity Impacts Cohesive Zone Model (CZM) Finite Element Analysis (FEA) VUMAT inter-laminar damage intra-laminar damage chemical grouting flowing water water plugging rate joint roughness coefficient damage model mode-II microcracks thermodynamics reinforced concrete beam impact and quasi-static loading retrofitting mineral grain shape particle flow code uniaxial compression simulation rock mechanical property mesostructure finite element analysis cohesive zone model high performance concrete fibre-reinforced high performance concrete compressive stress compressive modulus of elasticity maximum compressive strain tension pressure-tension apparatus nondestructive testing ultrasonic pulse velocity ABAQUS FEA high-temperature wedge splitting test fracture parameters reducing condition carbon-containing refractories strain-softening failure probability diamond composite material failure characteristics reliability rock cutting picks civil engineering fiber-reinforced composite laminate multi-directional laminate delamination elastic interface energy release rate mixed-mode fracture enhanced PG-NEM functionally graded material (FGM) stress intensity factor (SIF) modified interaction integral metallic glasses shear bands mechanical properties fracture mechanism small wind turbine stall regulation pitch regulation aeroelastic simulation Fatigue Fracture mechanics Structural integrity Polymers Composites Ceramics Concrete Rock Soft matter Advanced materials |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910557474603321 |
Spagnoli Andrea
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| Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2020 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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MEMS Packaging Technologies and 3D Integration
| MEMS Packaging Technologies and 3D Integration |
| Autore | Seok Seonho |
| Pubbl/distr/stampa | MDPI - Multidisciplinary Digital Publishing Institute, 2022 |
| Descrizione fisica | 1 electronic resource (210 p.) |
| Soggetto topico |
Research & information: general
Biology, life sciences |
| Soggetto non controllato |
heterogeneous integration
wafer bonding wafer sealing room-temperature bonding Au-Au bonding surface activated bonding Au film thickness surface roughness microelectromechanical systems (MEMS) packaging inkjet printing redistribution layers capacitive micromachined ultrasound transducers (CMUT) fan-out wafer-level packaging (FOWLP) adhesion thin film metal parylene neural probe scotch tape test FEM MEMS resonator temperature coefficient thermal stress millimeter-wave redundant TSV equivalent circuit model S-parameters extraction technology evaluation MEMS and IC integration MCDM fuzzy AHP fuzzy VIKOR fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging thermal sensors TMOS sensor finite difference time domain optical and electromagnetics simulations finite element analysis ultrasonic bonding metal direct bonding microsystem integration biocompatible packaging implantable reliability Finite element method (FEM) simulation multilayer reactive bonding integrated nanostructure-multilayer reactive system spontaneous self-ignition self-propagating exothermic reaction Pd/Al reactive multilayer system Ni/Al reactive multilayer system low-temperature MEMS packaging crack propagation microbump deflection angle stress intensity factor (SIF) polymer packaging neural interface chronic implantation |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910576876203321 |
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Seok Seonho
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| MDPI - Multidisciplinary Digital Publishing Institute, 2022 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
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