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Challenges and New Trends in Power Electronic Devices Reliability
Challenges and New Trends in Power Electronic Devices Reliability
Autore Falco Pasquale De
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (207 p.)
Soggetto topico Energy industries & utilities
Technology: general issues
Soggetto non controllato AC motor drive
AC-coupled configuration
accelerated test
AlGaN/GaN HEMT
availability
battery
bond wire
cables
capacitors
cascode structure
condition monitoring
cracks
current harmonics
DC-coupled configuration
DC/AC converter
electromagnetic launching field
failure monitoring
fusion algorithm
heavy-ion irradiation experiment
high-light mode
high-power thyristors
IGBT reliability
junction temperature
LED
lifetime prediction
loss modeling
low-light mode
maintenance
microgrid inverter
mission profile
module transconductance
multi-chip IGBT module
n/a
online evaluation
photovoltaic system
photovoltaic systems
power device
power electronic converters
power electronics
power MOSFET
power system faults
PPS
reliability
reverse recovery currents
segmented LSTM
sensor lamp
SiC MOSFET
single event effects
solder joint
technology computer-aided design simulation
temperature calibration
thermal cycling test
voltage harmonics
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910674042803321
Falco Pasquale De  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Radiation Tolerant Electronics / Paul Leroux
Radiation Tolerant Electronics / Paul Leroux
Autore Leroux Paul
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2019
Descrizione fisica 1 electronic resource (210 p.)
Soggetto topico History of engineering and technology
Soggetto non controllato single event effects
radiation-hardening-by-design (RHBD)
frequency divider by two
single event upset
Image processing
CMOS analog integrated circuits
FPGA
total ionizing dose (TID)
Impulse Sensitive Function
soft error
hardening by design
radiation hardening by design
X-rays
Single-Event Upsets (SEUs)
line buffer
heavy ions
VHDL
FPGA-based digital controller
radiation hardening by design (RHBD)
radiation hardening
SRAM-based FPGA
proton irradiation
ring oscillator
sensor readout IC
fault tolerance
space application
physical unclonable function
voltage controlled oscillator (VCO)
Ring Oscillators
analog single-event transient (ASET)
single event opset (SEU)
SEB
single event upsets
bipolar transistor
total ionizing dose
protons
triple modular redundancy (TMR)
gain degradation
space electronics
saturation effect
configuration memory
Co-60 gamma radiation
total ionization dose (TID)
frequency synthesizers
CMOS
PLL
TDC
single-event upsets (SEUs)
bandgap voltage reference (BGR)
4MR
single-shot
error rates
Radiation Hardening by Design
soft errors
heavy-ions
single-event effects (SEE)
single event transient (SET)
SEE testing
proton irradiation effects
RFIC
single event upset (SEU)
FMR
ionization
radiation tolerant
triplex-duplex
neutron irradiation effects
digital integrated circuits
single event gate rupture (SEGR)
power MOSFETs
ring-oscillator
selective hardening
voltage reference
nuclear fusion
TMR
gamma-rays
gamma ray
instrumentation amplifier
radiation effects
reference circuits
radiation-hardened
ISBN 9783039212804
303921280X
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910367565203321
Leroux Paul  
MDPI - Multidisciplinary Digital Publishing Institute, 2019
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Reliability Analysis of Electrotechnical Devices
Reliability Analysis of Electrotechnical Devices
Autore Tan Cher Ming
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (174 p.)
Soggetto topico History of engineering & technology
Technology: general issues
Soggetto non controllato 3D X-ray
3D-IC (three-dimensional integrated circuit)
BGA
bias temperature-humidity reliability test
conductive anodic filament (CAF)
de-penalization
deconvolution
deep space environment
elastic mechanical properties
electrochemistry based electrical model
electromagnetic interference
extreme thermal shocks
factorial design of experiment
finite element analysis
fracture failure
gamma process
GaN
genetic algorithm optimization
lifetime
lineal energy
linear energy transfer
low temperature
measurement system analysis
microdosimetry
Monte Carlo simulation
multiple-input multiple-output (MIMO)
n/a
near field measurement
operational amplifier
pressureless sintered micron silver joints
prompt gamma imaging
proton therapy
quality and reliability assurance
radiation hardness
reconstruction
reliability estimation
remaining useful life
return loss
SAC305
semi-empirical capacity fading model
simulation
single event effect
single event effects
state of health
useful life distribution
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910585945603321
Tan Cher Ming  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui