top

  Info

  • Utilizzare la checkbox di selezione a fianco di ciascun documento per attivare le funzionalità di stampa, invio email, download nei formati disponibili del (i) record.

  Info

  • Utilizzare questo link per rimuovere la selezione effettuata.
Composite Materials in Design Processes
Composite Materials in Design Processes
Autore Minak Giangiacomo
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (192 p.)
Soggetto topico Technology: general issues
Soggetto non controllato analytical model
Ansys ACP
breakdown strength
burn-off test
calcination test
carbon fiber-reinforced plastic (CFRP)
CFRP laminate
composite laminates
composite ship
composite structure
composites
constructal design
damage
damping
design optimization
electrical tree
electrodeposition
epoxy resin
experimental modal analysis
fabrics
FEM simulation
filling time
fracture
glass fiber content
heat exchange
insulating composite
laser etching
lightweight structures
microcapsule
morphology
n/a
nanofibers
natural frequencies
numerical simulation
OoA
orthogonal test
permeability characterization
photovoltaic roof
physical conditions
physical damage
polycrystalline silicon
polysulfone
polyvinylidene fluoride
porous media
prepreg
resin flow
RTM
self-healing
shear deformation
SiC whisker
slamming
solar vehicles
stiffness
tension-shear coupling
texture
thin composite panel
vibration response
viscoelastic layer
viscoelastic material
void volume
water jet
weave pattern
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910557433803321
Minak Giangiacomo  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Miniaturized Silicon Photodetectors : New Perspectives and Applications
Miniaturized Silicon Photodetectors : New Perspectives and Applications
Autore Casalino Maurizio
Pubbl/distr/stampa Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Descrizione fisica 1 online resource (148 p.)
Soggetto topico Technology: general issues
Soggetto non controllato 1/f noise
3.3 V/0.35 µm complementary metal-oxide-semiconductor (CMOS)
avalanche photodiode (APD)
avalanche transients
C/Si ratios
colloidal systems
complementary metal oxide semiconductor (CMOS)-compatible
gating
GeSn alloys
graphene
group IV
high dynamic range (HDR) image
impact ionization coefficients
infrared focal plane array (IRFPA)
microbolometer
microphotonics
n/a
near-infrared
Ni/4H-SiC Schottky barrier diodes (SBDs)
p-Si/i-ZnO/n-AZO
photodetector
photodetectors
photodiode
photonic integrated circuits
phototransistor
pixel
polycrystalline silicon
read-out integrated circuit (ROIC)
resonant cavity
semiconductor
silicon
silicon photonics
single-photon avalanche diode (SPAD)
thermal detectors
uncooled infrared detectors
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Altri titoli varianti Miniaturized Silicon Photodetectors
Record Nr. UNINA-9910557326803321
Casalino Maurizio  
Basel, Switzerland, : MDPI - Multidisciplinary Digital Publishing Institute, 2021
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui