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Advances in Plasma Processes for Polymers
Advances in Plasma Processes for Polymers
Autore Park Choon-Sang
Pubbl/distr/stampa Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Descrizione fisica 1 online resource (370 p.)
Soggetto topico Industrial chemistry and chemical engineering
Technology: general issues
Soggetto non controllato additive manufacturing
adhesion
ageing
allyl-substituted cyclic carbonate
aniline
anti-adhesive surface
ascorbic acid
atmospheric pressure plasma
atmospheric pressure plasma jet
atmospheric pressure plasma reactor (AP plasma reactor)
atmospheric pressure plasmas
atmospheric-pressure plasma
biomedical applications
BOPP foil
cellulose
cold plasma
conducting polymer
conductive polymer
continuum equation
corona discharge
cyclic olefin copolymer
DCSBD
dielectric barrier discharge
discharges in liquids
electrical discharges
enzymatic degradation
filler
fluorine depletion
free-radical polymerization
fumaric acid
gas products
gas sensors
gaseous plasma
glow-like discharge
GO reduction
grafting
graphene oxide
HMDSO
hydrogen plasma
hydrophilic
in-situ iodine (I2) doping
inflammatory/immunological response
intramuscularly implantation
ion beam sputtering
low-pressure plasma
low-temperature plasma polymerization
magnetron sputtering
methods of generation
microwave discharge
microwave discharge in liquid hydrocarbons
nanoparticles
NO2
oleofobization
PA6.6
PANI thin film
paper
piezoelectric direct discharge
PLA
plasma
plasma deposition
plasma diagnostics
plasma modeling
plasma polymerisation
plasma polymerization
plasma process
plasma properties
plasma treatment
plasma-fluorocarbon-polymer
poly(lactic acid)
polyamide
polyamide membranes
polyaniline (PANI)
polyethylene
polyethylene glycol
polylactic acid
polymer
polymer composite
polymer films
polymers
polytetrafluoroethylene
porous polythiophene
room temperature growth
single pin electrode
solid products
solution plasma
sublimation
surface activation
surface free energy
surface functionalization
surface modification
surface wettability
test ink
TiO2 + AgO coatings
titanium (Ti) alloys
toluidine blue method
VDBD
voltage multiplier
VUV radiation
water contact angle
wettability
XPS
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910580210703321
Park Choon-Sang  
Basel, : MDPI - Multidisciplinary Digital Publishing Institute, 2022
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui
Advances in Plasma Processes for Polymers II
Advances in Plasma Processes for Polymers II
Pubbl/distr/stampa MDPI - Multidisciplinary Digital Publishing Institute, 2023
Descrizione fisica 1 online resource (170 p.)
Soggetto topico Energy industries and utilities
History of engineering and technology
Technology: general issues
Soggetto non controllato 50/60 Hz
antibacterial effect
antimicrobial coating
APPJ
ASTM E2149
atmospheric plasma
atmospheric pressure
atmospheric pressure plasma
atmospheric pressure plasma jet
bacterial cellulose
biocompatibility
biopolymer
carbon nitride
chemical composition
commercial frequency
composite coatings
conical APPJ
conical-shaped
D-limonene
dextran coated cerium doped hydroxyapatite
dielectric barrier discharge (DBD)
E. coli bacteria
edible films
FTIR
functionalization
gelatin
human gingival fibroblast cells
klebsiella pneumonia
multi-bore tube
nitrogen addition
non-equilibrium gaseous plasma
non-woven fabric
PECVD
PEEK
phosphorus compound decomposition
photopolymerization
plasma
plasma polymerisation
plasma polymerization
plasma processing
plasma treatment
polyaniline nanostructures
polymer
polymer treatment
polypropylene
SEM
sputtering
staphylococcus aureus
starch
stereolithography (SLA)
surface modification
surface morphology
thin films
UV treatment
wettability
XPS
zinc oxide (ZnO)
Formato Materiale a stampa
Livello bibliografico Monografia
Lingua di pubblicazione eng
Record Nr. UNINA-9910743272703321
MDPI - Multidisciplinary Digital Publishing Institute, 2023
Materiale a stampa
Lo trovi qui: Univ. Federico II
Opac: Controlla la disponibilità qui